PACKAGE OPTION ADDENDUM

www.ti.com

17-Dec-2015

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device

Status

(1)

Package Type Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C)

Device Marking

(4/5)

Samples

85096012A

ACTIVE

LCCC

FK

20

1

TBD

POST-PLATE

N / A for Pkg Type

-55 to 125

85096012A

SNJ54ALS

253FK

8509601EA

ACTIVE

CDIP

J

16

1

TBD

A42

N / A for Pkg Type

-55 to 125

8509601EA

SNJ54ALS253J

SN74ALS253D

ACTIVE

SOIC

D

16

40

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

ALS253

SN74ALS253DG4

ACTIVE

SOIC

D

16

40

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

ALS253

SN74ALS253DR

ACTIVE

SOIC

D

16

2500

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

ALS253

SN74ALS253DRG4

ACTIVE

SOIC

D

16

2500

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

ALS253

SN74ALS253N

ACTIVE

PDIP

N

16

25

Pb-Free

(RoHS)

CU NIPDAU

N / A for Pkg Type

0 to 70

SN74ALS253N

SN74ALS253NSR

OBSOLETE

SO

NS

16

TBD

Call TI

Call TI

0 to 70

SN74ALS253NSRE4

OBSOLETE

SO

NS

16

TBD

Call TI

Call TI

0 to 70

SN74ALS253NSRG4

OBSOLETE

SO

NS

16

TBD

Call TI

Call TI

0 to 70

SN74AS253AD

ACTIVE

SOIC

D

16

40

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

AS253A

SN74AS253ADE4

ACTIVE

SOIC

D

16

40

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

AS253A

SN74AS253AN

OBSOLETE

PDIP

N

16

TBD

Call TI

Call TI

0 to 70

SN74AS253ANE4

ACTIVE

PDIP

N

16

TBD

Call TI

Call TI

0 to 70

SNJ54ALS253FK

ACTIVE

LCCC

FK

20

1

TBD

POST-PLATE

N / A for Pkg Type

-55 to 125

85096012A

SNJ54ALS

253FK

SNJ54ALS253J

ACTIVE

CDIP

J

16

1

TBD

A42

N / A for Pkg Type

-55 to 125

8509601EA

SNJ54ALS253J

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.