If MilitaryAerospace specified devices are required

please contact the National Semiconductor Sales

OfficeDistributors for availability and specifications

Min

Max

Units

All Output and Supply Voltages

b

05

a

70

V

All Input Voltages

b

10

a

55

V

Output Currents

125

mA

Maximum Power Dissipation at 25 C

Cavity Package

1509

mW

Molded Package

1476

mW

Note

Derate cavity package 101 mW C above 25 C derate molded

package 118 mW C above 25 C

Min

Max Units

Storage Temperature

b

C

Lead Temperature (soldering 4 seconds)

260

C

Operating Conditions

Min

Max

Units

DP8216M DP8226M

45

55

V

DP8216 DP8226

475

525

V

DP8216M DP8226M

b

55

a

125

C

DP8216 DP8226

0

a

70

C

Symbol

Parameter

Conditions

Limits

Units

Min

Typ

Max

DRIVERS

Input Low Voltage

095

V

Input High Voltage

2

V

Input Load Current

b

003

b

025

mA

Input Leakage Current

10

m

A

Input Clamp Voltage

b

12

V

Output Low Voltage

03

045

V

Output Low Voltage

05

06

V

Output High Voltage

24

30

V

Output Short Circuit Current

b

30

b

75

b

120

mA

Output Leakage Current TRI-STATE

100

m

A

RECEIVERS

Input Low Voltage

095

V

Input High Voltage

2

V

Input Load Current

b

008

b

025

mA

Input Clamp Voltage

b

12

V

Output Low Voltage

03

045

V

Output High Voltage

365

40

V

Output Short Circuit Current

b

15

b

35

b

65

mA

Output Leakage Current TRI-STATE

20

m

A

CONTROL INPUTS (CS DIEN)

Input Low Voltage

095

V

Input High Voltage

2

V

Input Load Current

b

015

b

05

mA

Input Leakage Current

20

m

A

Power Supply Current

DP8216

95

130

mA

DP8226

85

120

mA

2