DAC8564

SBAS403D

– JUNE 2007 – REVISED MAY 2011

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

RELATIVE

DIFFERENTIAL

REFERENCE

SPECIFIED

ACCURACY

NONLINEARITY

DRIFT

PACKAGE-

PACKAGE

TEMPERATURE

PACKAGE

PRODUCT

(LSB)

(LSB)

(ppm/

°C)

LEAD

DESIGNATOR

RANGE

MARKING

DAC8564A

±12

±1

25

TSSOP-16

PW

–40°C to +105°C

DAC8564

DAC8564B

±8

±1

25

TSSOP-16

PW

–40°C to +105°C

DAC8564B

DAC8564C

±12

±1

5

TSSOP-16

PW

–40°C to +105°C

DAC8564

DAC8564D

±8

±1

5

TSSOP-16

PW

–40°C to +105°C

DAC8564D

(1)

For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

(1)

Over operating free-air temperature range (unless otherwise noted).

DAC8564

UNIT

–0.3 to +6

V

Digital input voltage to GND

V

V

V

Operating temperature range

–40 to +125

°C

Storage temperature range

–65 to +150

°C

+150

°C

Power dissipation

W

Thermal impedance,

+118

°C/W

Thermal impedance,

+29

°C/W

Human body model (HBM)

4000

V

ESD rating

Charged device model (CDM)

1500

V

(1)

Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute

maximum conditions for extended periods may affect device reliability.

2

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© 2007–2011, Texas Instruments Incorporated