CD74FCT240M datasheet(2/12 Pages) TI1

2 / 12 page

CD74FCT240

BiCMOS OCTAL BUFFER/LINE DRIVER

WITH 3-STATE OUTPUTS

SCBS729 − JULY 2000

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

logic symbol†

1A1

1A2

1A3

1A4

1Y1

1Y2

1Y3

1Y4

2A1

2A2

2A3

2A4

2Y1

2Y2

2Y3

2Y4

1OE

† This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.

2OE

logic diagram (positive logic)

218

1Y1

1OE

1A1

416

1Y2

1A2

614

1Y3

1A3

812

1Y4

1A4

2Y1

2OE

2A1

2Y2

2A2

2Y3

2A3

2Y4

2A4

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)‡

DC supply voltage range, VCC

−0.5 V to 6 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DC input clamp current, IIK (VI < −0.5 V)

−20 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DC output clamp current, IOK (VO < −0.5 V)

−50 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DC output sink current per output pin, IOL

70 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DC output source current per output pin, IOH

−30 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Continuous current through VCC, ICC

140 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Continuous current through GND

528 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Package thermal impedance,

θJA (see Note 1): E package

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

M package

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

SM package

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Storage temperature range, Tstg

−65

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

‡ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTE 1: The package thermal impedance is calculated in accordance with JESD 51.

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