CPC40055ST datasheet(3/8 Pages) IXYS

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R03

CPC40055ST

Thermal Characteristics

2.1 Heat Sink Calculation

Higher load currents are possible by using lower thermal resistance heat sink combinations.

2.2 Thermal Performance Data

Parameter

Conditions

Symbol

Rating

Units

Thermal Resistance (Junction to Case)



0.35

°C/W

Thermal Resistance (Junction to Ambient)

Free Air



°C/W

Junction Temperature (Operating)

-40 to +150

°C

CA =

J - TA)

J = Junction Temperature (°C), TJ ≤ 150°C *

A = Ambient Temperature (°C)

JC = Thermal Resistance, Junction to Case (°C/W) = 0.35°C/W

CA = Thermal Resistance of Heat Sink & Thermal Interface Material , Case to Ambient (°C/W)

D = On-State Voltage (Vrms) • Load Current (Arms)

* Elevated junction temperature reduces semiconductor lifetime.

NOTE: The exposed surface of the DCB substrate is not to be soldered.

Heat Sink Rating

Ambient Temperature (ºC)

1020

5060

8090

Output Power

vs. Ambient Temperature

Heat Sink

2ºC/W

5ºC/W

10ºC/W

15ºC/W

No Heat Sink

Load Current (A

rms)

Output Power

vs. Load Current

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