IX2120

R02

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13

3.5 Mechanical Dimensions

3.5.1 IX2120: 28-Pin SOIC Package

3.5.2 IX2120 Tape & Reel Information

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IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make

changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated

Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its

products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.

The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other

applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe

property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.

Specification: DS-IX2120-R02

©Copyright 2016, IXYS Integrated Circuits Division

All rights reserved. Printed in USA.

2/3/2016

17.70 to 18.10

(0.697 to 0.713)

See Note 3

7.40 to 7.60

(0.291 to 0.299)

See Note 4

10.00 to 10.65

(0.394 to 0.419)

0.31 to 0.51 28x

(0.012 to 0.020) 28x

2.35 to 2.65

(0.093 to 0.104)

1.27 26x

(0.05) 26x

0.10 to 0.30

(0.004 to 0.012)

5º to 15º 4x

0.40 to 1.27

(0.016 to 0.050)

0º to 8º

0.20 to 0.33

(0.008 to 0.013)

See Note 6

0.25 to 0.75 x 45º

(0.010 to 0.030) x 45º

See Note 5

Seating Plane

(MIN to MAX inches)

MIN to MAX mm

DIMENSIONS

0.10

(0.004)

Recommended PCB Land Pattern

9.30

(0.366)

1.27

(0.050)

0.60

(0.024)

2.00

(0.079)

Notes:

1. All dimensions are in mm / (inches).

2. This package conforms to JEDEC Standard MS-013, variation AE issue C.

3. Dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15mm per end.

4. Dimension does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.25mm per side.

5. This chamfer is optional. If it is not present, then a Pin 1 identifier must be located as shown.

6. The dimension applies to the flat section of the lead between 0.10mm to 0.25mm from the lead tip.

Pin 1

Identifier

Dimensions

mm

(inches)

Top Cover

Tape Thickness

0.102 MAX

(0.004 MAX)

330.2 DIA.

(13.00 DIA)

Embossed Carrier

Embossment

A

(0.429)

B

(0.720)

W=24.00+0.03/-0.01

(0.945+0.001/-0.0004)

K

(0.106)

K

(0.126)

P=12.00

(0.472)

Notes:

1. Unless otherwise specified, all dimensional tolerances per EIA standard 481

2. Unless otherwise specified, all dimensions ±0.10 (0.004)