IX2127

R03

www.ixysic.com

13

3.5.3 Tape & Reel Packaging for 8-Pin SOIC Package

Dimensions

mm

(inches)

NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2

Embossment

Embossed Carrier

Top Cover

Tape Thickness

0.102 MAX.

(0.004 MAX.)

330.2 DIA.

(13.00 DIA.)

K

(0.083)

W=12.00

(0.472)

B

(0.209)

User Direction of Feed

A

(0.256)

P=8.00

(0.315)

IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and

reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses or indemnity are expressed

or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability

whatsoever, and disclaims any express or implied warranty relating to its products, including, but not limited to, the implied warranty of merchantability, fitness for a

particular purpose, or infringement of any intellectual property right.

The products described in this document are not designed, intended, authorized, or warranted for use as components in systems intended for surgical implant into

the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical

harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes

to its products at any time without notice.

Specification: DS-IX2127-R03

©Copyright 2012, IXYS Integrated Circuits Division

All rights reserved. Printed in USA.

12/19/2012