OBSOLETE

LM2575EP, LM2575HVEP

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SNVS301B – DECEMBER 2004 – REVISED APRIL 2013

When no heat sink is used, the junction temperature rise can be determined by the following:

(11)

To arrive at the actual operating junction temperature, add the junction temperature rise to the maximum ambient

temperature.

(12)

If the actual operating junction temperature is greater than the selected safe operating junction temperature

determined in step 3, then a heat sink is required.

When using a heat sink, the junction temperature rise can be determined by the following:

(13)

The operating junction temperature will be:

(14)

As above, if the actual operating junction temperature is greater than the selected safe operating junction

temperature, then a larger heat sink is required (one that has a lower thermal resistance).

When using the LM2575EP in the PDIP (N) or surface mount (DW) packages, several items about the thermal

properties of the packages should be understood. The majority of the heat is conducted out of the package

through the leads, with a minor portion through the plastic parts of the package. Since the lead frame is solid

copper, heat from the die is readily conducted through the leads to the printed circuit board copper, which is

acting as a heat sink.

For best thermal performance, the ground pins and all the unconnected pins should be soldered to generous

amounts of printed circuit board copper, such as a ground plane. Large areas of copper provide the best transfer

of heat to the surrounding air. Copper on both sides of the board is also helpful in getting the heat away from the

package, even if there is no direct copper contact between the two sides. Thermal resistance numbers as low as

40°C/W for the SOIC package, and 30°C/W for the N package can be realized with a carefully engineered pc

board.

Included on the Switchers Made Simple design software is a more precise (non-linear) thermal model that can

be used to determine junction temperature with different input-output parameters or different component values.

It can also calculate the heat sink thermal resistance required to maintain the regulators junction temperature

below the maximum operating temperature.

ADDITIONAL APPLICATIONS

INVERTING REGULATOR

Figure 31 shows a LM2575-12EP in a buck-boost configuration to generate a negative 12V output from a positive

input voltage. This circuit bootstraps the regulator's ground pin to the negative output voltage, then by grounding

the feedback pin, the regulator senses the inverted output voltage and regulates it to

−12V.

For an input voltage of 12V or more, the maximum available output current in this configuration is approximately

0.35A. At lighter loads, the minimum input voltage required drops to approximately 4.7V.

The switch currents in this buck-boost configuration are higher than in the standard buck-mode design, thus

lowering the available output current. Also, the start-up input current of the buck-boost converter is higher than

the standard buck-mode regulator, and this may overload an input power source with a current limit less than

1.5A. Using a delayed turn-on or an undervoltage lockout circuit (described in the next section) would allow the

input voltage to rise to a high enough level before the switcher would be allowed to turn on.

Because of the structural differences between the buck and the buck-boost regulator topologies, the buck

regulator design procedure section can not be used to select the inductor or the output capacitor. The

recommended range of inductor values for the buck-boost design is between 68

μH and 220 μH, and the output

capacitor values must be larger than what is normally required for buck designs. Low input voltages or high

output currents require a large value output capacitor (in the thousands of micro Farads).

Copyright © 2004–2013, Texas Instruments Incorporated

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