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LM3435 数据表(PDF) 3 Page - Texas Instruments |
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LM3435 数据表(HTML) 3 Page - Texas Instruments |
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3 / 27 page ![]() LM3435 www.ti.com SNVS724C – JUNE 2011 – REVISED MAY 2013 Pin Descriptions (continued) Pin Name Type Description Application Information 28 EN Input Enable pin Internally pull-up. Connect to a voltage lower than 0.2 x VIN to disable the device. 30, 31, 32 VOUT Input / Output voltage Connect anodes of LEDs to this pin. Output 33 RT Input ON-time control An external resistor connected from VOUT to this pin sets the main MOSFET on-time, hence determine the switching frequency. 34, 35, 36 SW Output Switch node Internally connected to the drain of the main N-channel MOSFET and the P-channel synchronous MOSFET. Connect to the output inductor. EP EP Ground Exposed Pad Thermal connection pad, connect to the GND pin. These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ABSOLUTE MAXIMUM RATINGS (1) VALUE / INPUTS VIN to GND –0.3V to 6.0V VOUT, RT to VIN –0.3V to 5.5V RLED, GLED, BLED to VIN –0.3V to 5.5V SW to GND –0.3V to 11.5V SW to GND (Transient) –2V to 13V (<100 ns) All other inputs to GND –0.3V to 6.0V ESD Rating Human Body Model (2) ±1.5 kV Storage Temperature –65°C to +150°C Junction Temperature (TJ) –40°C to +125°C (1) Absolute Maximum Ratings are limits which damage to the device may occur. Operating ratings are conditions under which operation of the device is intended to be functional. For specifications and test conditions, see the electrical characteristics. (2) The human body model is a 100 pF capacitor discharged through a 1.5 k Ω resistor into each pin. RECOMMENDED OPERATING CONDITIONS (1) VALUE / INPUTS Supply Voltage Range (VIN) 2.7V to 5.5V Junction Temp. Range (TJ) –40°C to +125°C Thermal Resistance ( θJB) (2) 28°C/W (1) Absolute Maximum Ratings are limits which damage to the device may occur. Operating ratings are conditions under which operation of the device is intended to be functional. For specifications and test conditions, see the electrical characteristics. (2) θJB is junction-to-board thermal characteristic parameter. For packages with exposed pad, θJB is significantly dependent on PC boards. So, only when the PC board under end-user environments is similar to the 2L JEDEC board, the corresponding θJB can be used to predict the junction temperature. θJB value is obtained by NS Thermal Calculator © for reference only. Copyright © 2011–2013, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LM3435 |
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