Product Specification

Revision: B

Date: October 30, 2015

© Samtec, Inc.

Page 6

7.2 Mating Angle Requirements: Connectors to be mated and unmated axially only. Zippering angles may damage

connector and/or solder joints.

7.2.1

7.2.2

7.3 Maximum Reflow Passes: The parts can withstand three reflow passes at a maximum component temperature of

260°C.

7.4 Stencil Thickness: The stencil thickness is

.006” (0,15 mm).

7.5 Placement: Machine placement of the parts is recommended.

7.6 Hardware: Board-to-board standoffs are recommended to provide a robust mechanical connection.

Samtec’s wide

variety of standoff options can be found here: SO - Board Stacking Standoff

7.7 Reflow Environment: Samtec recommends the use of a low level oxygen environment (typically achieved through

Nitrogen gas infusion) in the reflow process to improve solderability.

7.8 Samtec, Inc. has verified that our connectors may be cleaned in accordance with the solvents and conditions

designated in the EIA-364-11A standard.