EMIF04-2005QCF

2/4

Symbol

Parameter and test conditions

Value

Unit

V

PP

ESD discharge

EC61000-4-2 air discharge

IEC61000-4-2 contact discharge

±15

±8

kV

T

j

Junction temperature

125

°C

T

stg

Storage temperature range

-55 + 150

°C

T

op

Operating temperature range

-40 to + 85

°C

T

L

Maximum lead temperature for soldering during 10s at 5mm from case

260

°C

ABSOLUTE RATINGS (Tamb = 25°C)

Symbol

Parameter

V

BR

Breakdown voltage

I

RM

Leakage current @ V

RM

V

RM

Stand-off voltage

V

CL

Clamping voltage

I

PP

Peak pulse current

αT

Voltage temperature coefficient

V

F

Forward voltage drop

ELECTRICAL CHARACTERISTICS (T

I

V

Symbol

Test conditions

Min.

Typ.

Max.

Unit

V

BR

I

6

8

10

V

I

RM

V

500

µA

Rd

I

1

Ω

R

I/O

180

200

220

Ω

C

in

@ 0V bias

45

50

pF

-40.00

-35.00

-30.00

-25.00

-20.00

-15.00

-10.00

-5.00

-40.00

-35.00

-30.00

-25.00

-20.00

-15.00

-10.00

-5.00

-40.00

-35.00

-30.00

-25.00

-20.00

-15.00

-10.00

-5.00

Aplac 7.62 User: STMicroelectronics

Emif04: S21(dB) response

100.0k

1.0M

10.0M

100.0M

1.0G

f/Hz

100.0k

1.0M

10.0M

100.0M

1.0G

100.0k

1.0M

10.0M

100.0M

1.0G

f/Hz

f/Hz

EMIF04-2005QCF

Fig. 1: Filtering behavior.

0.0

5.0

10.0

15.0

20.0

25.0

30.0

35.0

40.0

45.0

50.0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

V (V)

R

CLine(pF)

C(V)

Fig. 2: Capacitance versus reverse applied voltage.