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LM5134AMF/NOPB 数据表(PDF) 3 Page - Texas Instruments |
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LM5134AMF/NOPB 数据表(HTML) 3 Page - Texas Instruments |
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3 / 27 page ![]() VDD OUT PILOT VSS IN INB 5 6 4 1 2 3 3 LM5134 www.ti.com SNVS808C – MAY 2012 – REVISED FEBRURARY 2016 Product Folder Links: LM5134 Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated 5 Pin Configuration and Functions DBV Package, NGG Package 6-Pin SOT-23, 6-Pin WSON Top View Pin Functions PIN I/O DESCRIPTION APPLICATION INFORMATION NAME NO. VDD 1 — Gate drive supply Locally decouple to VSS using low ESR/ESL capacitor located as close as possible to the IC. PILOT 2 O Gate drive output for an external turnoff FET Connect to the gate of a small turnoff MOSFET with a short, low inductance path. The turnoff FET provides a local turnoff path. OUT 3 O Gate drive output for the power FET Connect to the gate of the power FET with a short, low inductance path. A gate resistor can be used to eliminate potential gate oscillations. VSS 4 — Ground All signals are referenced to this ground. INB 5 I Inverting logic input Connect to VSS when not used. IN 6 I Non-inverting logic input Connect to VDD when not used. EP EP — Exposed Pad It is recommended that the exposed pad on the bottom of the package be soldered to ground plane on the PC board, and that ground plane extend out from beneath the IC to help dissipate heat. (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Pin voltage VDD to VSS −0.3 14 V IN, INB to VSS −0.3 14 Junction temperature, TJ 150 °C Storage temperature, Tstg −55 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V Charged-device model (CDM), per JEDEC specification JESD22- C101(2) ±1000 |
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