| 数据搜索系统,热门电子元器件搜索 |
|
LMH1981MT/NOPB 数据表(PDF) 18 Page - Texas Instruments |
|
|
|
|||||||||||||||||||||||||||||
LMH1981MT/NOPB 数据表(HTML) 18 Page - Texas Instruments |
|
18 / 24 page ![]() LMH1981 SNLS214H – APRIL 2006 – REVISED MARCH 2013 www.ti.com For example, a significant decrease in APL such as a white-to-black field transition will cause a positive-going shift in the sync tips characterized by the source’s RC time constant, tRC-OUT (150Ω*COUT). The LMH1981’s input clamp circuitry may have difficulty stabilizing the input signal under this type of shifting; consequently, the unstable signal at VIN may cause missing sync output pulses to result, unless a proper value for CIN is chosen. To avoid this potential problem when interfacing AC-coupled sources to the LMH1981, it’s necessary to introduce a voltage droop component via CIN to compensate for video signal shifting related to changes in the APL. This can be accomplished by selecting CIN such that the effective time constant of the LMH1981’s input circuit, tRC-IN, is less than tRC-OUT. The effective time constant of the input circuit can be approximated as: tRC-IN = (RS+RI)*CIN*TLINE/TCLAMP, where RS = 150Ω, RI = 4000Ω (input resistance), TLINE ∼ 64 μs for NTSC, and TCLAMP = 250 ns (internal clamp duration). A white-to-black field transition in NTSC video through COUT will exhibit the maximum sync tip shifting due to its long line period (TLINE). By setting tRC-IN < tRC-OUT, the maximum value of CIN can be calculated to ensure proper operation under this worst-case condition. For instance, tRC-OUT is about 33 ms for COUT = 220 µF. To ensure tRC-IN < 33 ms, CIN must be less than 31 nF. By choosing CIN = 0.01 μF, the LMH1981 will function properly with AC-coupled video sources using COUT ≥ 220 μF. PCB LAYOUT CONSIDERATIONS LMH1981 IC Placement The LMH1981 should be placed such that critical signal paths are short and direct to minimize PCB parasitics from degrading the high-speed video input and logic output signals. Ground Plane A two-layer, FR-4 PCB is sufficient for this device. One of the PCB layers should be dedicated to a single, solid ground plane that runs underneath the device and connects the device GND pins together. The ground plane should be used to connect other components and serve as the common ground reference. It also helps to reduce trace inductances and minimize ground loops. Try to route supply and signal traces on another layer to maintain as much ground plane continuity as possible. Power Supply Pins The power supply pins should be connected together using short traces with minimal inductance. When routing the supply traces, be careful not to disrupt the solid ground plane. For high frequency bypassing, place 0.1 µF SMD ceramic bypass capacitors with very short connections to power supply and GND pins. Two or three ceramic bypass capacitors can be used depending on how the supply pins are connected together. Place a 4.7 µF SMD tantalum bypass capacitor nearby all three power supply pins for low frequency supply bypassing. REXT Resistor The REXT resistor should be a 10 kΩ 1% SMD precision resistor. Place REXT as close as possible to the device and connect to pin 1 and the ground plane using the shortest possible connections. All input and output signals must be kept away from this pin to prevent unwanted signals from coupling into this pin. Video Input The input signal path should be routed using short, direct traces between video source and input pin. Use a 75 Ω input termination and a SMD capacitor for AC coupling the video input to pin 4. Output Routing The output signal paths should be routed using short, direct traces to minimize parasitic effects that may degrade these high-speed logic signals. All output signals should have a resistive load of about 10 k Ω and capacitive load of less than 10 pF, including parasitic capacitances for optimal signal quality. This is especially important for the horizontal sync output, in which it is critical to minimize timing jitter. Each output can be protected by current limiting with a small series resistor, like 100 Ω. 18 Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: LMH1981 |
|
|
链接网址 |
| ALLDATASHEET是否为您带来帮助? [ DONATE ] |
关于 Alldatasheet | 广告服务 | 联系我们 | 隐私政策 | 数据表链接 | 链接交换 | 制造商名单 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |