LMV641MAESLASHNOPB datasheet(2/27 Pages) TI1

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LMV641

SNOSAW3C – SEPTEMBER 2007 – REVISED FEBRUARY 2013

www.ti.com

Absolute Maximum Ratings

(1) (2)

ESD Tolerance (3)

Human Body Model

2000V

Machine Model

200V

Differential Input VID

±0.3V

Supply Voltage (VS = V

+ - V−)

13.2V

Input/Output Pin Voltage

V+ +0.3V, V−

−0.3V

Storage Temperature Range

−65°C to +150°C

Junction Temperature (4)

+150°C

Soldering Information

Infrared or Convection (20 sec)

235°C

Wave Soldering Lead Temp (10 sec)

260°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test

conditions, see the Electrical Characteristics Tables.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office / Distributors for

availability and specifications.

(3)

Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of

JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).

(4)

The maximum power dissipation is a function of TJ(MAX, θJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) - TA)/ θJA. All numbers apply for packages soldered directly onto a PC board.

Operating Ratings

(1)

Temperature Range (2)

−40°C to 125°C

Supply Voltage (VS = V

+ - V−)

2.7V to 12V

Package Thermal Resistance (

θJA)

(2)

5-Pin SC70

456°C/W

8-Pin SOIC

166°C/W

5-Pin SOT-23

325°C/W

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test

conditions, see the Electrical Characteristics Tables.

(2)

The maximum power dissipation is a function of TJ(MAX, θJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX) - TA)/ θJA. All numbers apply for packages soldered directly onto a PC board.

2.7V DC Electrical Characteristics

Unless otherwise specified, all limits are guaranteed for TA = 25°C, V

+ = 2.7V, V− = 0V, V

O = VCM = V

+/2, and R

L > 1 MΩ.

Boldface limits apply at the temperature extremes.

Min

Typ

Max

Symbol

Parameter

Conditions

Units

(1)

(2)

(1)

500

µV

VOS

Input Offset Voltage

750

TC VOS

Input Offset Average Drift

0.1

μV/°C

Input Bias Current

(3)

110

IOS

Input Offset Current

0.9

114

CMRR

Common Mode Rejection Ratio

≤ VCM ≤ 1.7V

(1)

Limits are 100% production tested at 25°C. Limits over the operating temperature range are guaranteed through correlations using

Statistical Quality Control (SQC) method.

(2)

Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary

over time and will also depend on the application and configuration. The typical values are not tested and are not guaranteed on

shipped production material.

(3)

Positive current corresponds to current flowing into the device.

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