PACKAGE OPTION ADDENDUM

www.ti.com

15-Oct-2015

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device

Status

(1)

Package Type Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C)

Device Marking

(4/5)

Samples

5962-86053013A

NRND

LCCC

FK

28

1

TBD

Call TI

Call TI

-55 to 125

5962-

86053013A

TIBPAL22

V10AMFKB

5962-8605301KA

NRND

CFP

W

24

1

TBD

Call TI

Call TI

-55 to 125

5962-8605301KA

TIBPAL22V10AMW

B

5962-8605301LA

NRND

CDIP

JT

24

1

TBD

Call TI

Call TI

-55 to 125

5962-8605301LA

TIBPAL22V10AMJ

TB

TIBPAL22V10AMFKB

NRND

LCCC

FK

28

1

TBD

POST-PLATE

N / A for Pkg Type

-55 to 125

5962-

86053013A

TIBPAL22

V10AMFKB

TIBPAL22V10AMJT

NRND

CDIP

JT

24

1

TBD

A42

N / A for Pkg Type

-55 to 125

TIBPAL22V10AMJ

T

TIBPAL22V10AMJTB

NRND

CDIP

JT

24

1

TBD

A42

N / A for Pkg Type

-55 to 125

5962-8605301LA

TIBPAL22V10AMJ

TB

TIBPAL22V10AMWB

NRND

CFP

W

24

1

TBD

A42

N / A for Pkg Type

-55 to 125

5962-8605301KA

TIBPAL22V10AMW

B

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.