TL75LPxxQ SERIES

TL75LPxxY SERIES

LOW DROPOUT VOLTAGE REGULATORS

SLVS073A − SEPTEMBER 1992 − REVISED AUGUST 1995

Copyright

3−1

POST OFFICE BOX 655303

POST OFFICE BOX 1443

400 mV at 300 mA

Maximum of 150

µA

Temperature Range

Package

description

The TL75LPxxQ devices are low-dropout voltage

regulators specifically targeted for use in portable

applications. These devices generate fixed output

voltages at loads of up to 300 mA with only

400-mV dropout over the full temperature range.

Low-dropout voltage regulators are commonly

used in battery-powered systems such as analog

and digital cellular phones. The TL75LPxx family

of regulators feature a TTL/CMOS-compatible

enable terminal, which can be used to switch the

device into standby mode. This feature reduces

power consumption when the instrument is not

active. Less that 150

µA is required when the unit

is disabled.

A concern in many new designs is conservation of

board space and overall reduction in equipment

size. The thin shrink small-outline package

(TSSOP) minimizes board area and reduces

component height. This package has a maximum height of less than 1.1 mm (compared to the 1.75 mm of a

standard 8-pin SO package) and dimensions of only 6.5 mm by 4.4 mm.

All low-dropout regulators require an external capacitor at the output to maintain regulation and stability. To

further reduce board area and cost, the TL75LPxx devices are designed to require a minimum capacitor of only

10

µF. This is 1/10 the typical value used by many other low-dropout regulators. To simplify the task of choosing

a suitable capacitor, TI has included in this datasheet a list of recommended capacitors for use with these

devices.

AVAILABLE OPTIONS

VO

PACKAGED DEVICES

CHIP FORM

TJ

VO

TSSOP

CHIP FORM

(Y)

TJ

MIN

TYP

MAX

TSSOP

(PW)

CHIP FORM

(Y)

4.75

4.85

4.95

TL75LP48QPWLE

TL75LP48Y

4.9

5

5.1

TL75LP05QPWLE

TL75LP05Y

−40

°C to 125°C

7.84

8

8.16

TL75LP08QPWLE

TL75LP08Y

−40 C to 125 C

9.8

10

10.2

TL75LP10QPWLE

TL75LP10Y

11.76

12

12.24

TL75LP12QPWLE

TL75LP12Y

The PW package is available only in tape and reel. Chip forms are tested at 25

°C.

typical application schematic

VBAT

INPUT

OUTPUT

TL75LPxxQ

GND/

HEAT SINK

ENABLE

0.1

µF

VO ± 2%

at 300 mA

CO = 10 µF

2 V

DISABLE

ENABLE

1

2

3

4

5

6

7

8

9

10

20

19

18

17

16

15

14

13

12

11

GND/HEAT SINK

GND/HEAT SINK

GND/HEAT SINK

NC

NC

ENABLE

NC

INPUT

INPUT

INPUT

NC

NC

NC

NC

NC

OUTPUT

OUTPUT

NC

NC

NC

PW PACKAGE

(TOP VIEW)

GND/HEAT SINK − These terminals have an internal

connection to ground and must be grounded.

NC − No internal connection

† The PW package is only available in left-end taped

and reeled (order device TL75LPxxQPWLE).

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.