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LP2954IM 数据表(PDF) 2 Page - Texas Instruments |
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LP2954IM 数据表(HTML) 2 Page - Texas Instruments |
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2 / 28 page ![]() 2 LP2954, LP2954A SNVS096E – JUNE 1999 – REVISED JULY 2016 www.ti.com Product Folder Links: LP2954 LP2954A Submit Documentation Feedback Copyright © 1999–2016, Texas Instruments Incorporated Table of Contents 1 Features .................................................................. 1 2 Applications ........................................................... 1 3 Description ............................................................. 1 4 Revision History..................................................... 2 5 Pin Configuration and Functions ......................... 3 6 Specifications......................................................... 4 6.1 Absolute Maximum Ratings ...................................... 4 6.2 ESD Ratings.............................................................. 4 6.3 Recommended Operating Conditions ....................... 4 6.4 Thermal Information .................................................. 4 6.5 Electrical Characteristics........................................... 5 6.6 Typical Characteristics .............................................. 7 7 Detailed Description ............................................ 10 7.1 Overview ................................................................. 10 7.2 Functional Block Diagrams ..................................... 10 7.3 Feature Description................................................. 11 7.4 Device Functional Modes........................................ 12 8 Application and Implementation ........................ 13 8.1 Application Information............................................ 13 8.2 Typical Application ................................................. 13 9 Power Supply Recommendations ...................... 17 10 Layout................................................................... 18 10.1 Layout Guidelines ................................................. 18 10.2 Layout Example .................................................... 18 11 Device and Documentation Support ................. 19 11.1 Related Documentation ....................................... 19 11.2 Related Links ........................................................ 19 11.3 Receiving Notification of Documentation Updates 19 11.4 Community Resources.......................................... 19 11.5 Trademarks ........................................................... 19 11.6 Electrostatic Discharge Caution ............................ 19 11.7 Glossary ................................................................ 19 12 Mechanical, Packaging, and Orderable Information ........................................................... 20 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision D (March 2013) to Revision E Page • Changed "voltage regulator" to "LDO".................................................................................................................................... 1 • Added Device Information and Pin Configuration and Functions sections, ESD Ratings and Thermal Information tables, Feature Description, Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sections; added top nav icon for TI Designs ....................................................................................................... 1 • Changed RθJA value for DDPAK/TO-263 from "73°C/W" to "44.3°C/W"; TO-220 from "60°C/W" to "80.3°C/W"; SOIC from "160°C/W" to "105.0°C/W". These values were in former FN 3 to Abs Max table......................................................... 4 • Added Power Dissipation ..................................................................................................................................................... 15 • Added Estimating Junction Temperature ............................................................................................................................. 15 Changes from Revision C (March 2013) to Revision D Page • Changed layout of National Semiconductor data sheet to TI format.................................................................................... 18 |
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