LP2986

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SNVS137I – MARCH 1999 – REVISED SEPTEMBER 2015

10.3 WSON Mounting

The LDC08A (pullback) 8-pin WSON package requires specific mounting techniques which are detailed in Texas

Instruments Application Note Leadless Leadframe Package (LLP) (SNOA401). Referring to the section PCB

Design Recommendations in SNOA401, the pad style which should be used with this WSON package is the

NSMD (non-solder mask defined) type. Additionally, for optimal reliability, there is a recommended 1:1 ratio

between the package pad and the PCB pad for the pullback WSON.

The thermal dissipation of the WSON package is directly related to the printed circuit board construction and the

amount of additional copper area connected to the DAP.

The DAP (exposed pad) on the bottom of the WSON package is connected to the die substrate with a conductive

die attach adhesive. The DAP has no direct electrical (wire) connection to any of the eight pins. There is a

parasitic PN junction between the die substrate and the device ground. As such, it is strongly recommend that

the DAP be connected directly to the ground at device pin 1 (GROUND). Alternately, but not recommended, the

DAP may be left floating (that is, no electrical connection). The DAP must not be connected to any potential other

than ground.

the case is on the bottom of the package at the center of the DAP.

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