LP2989

SNVS083O – FEBRUARY 2005 – REVISED MARCH 2015

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Table of Contents

7.3

Feature Description................................................. 14

1

Features .................................................................. 1

7.4

Device Functional Modes........................................ 15

2

Applications ........................................................... 1

8

Application and Implementation ........................ 16

3

Description ............................................................. 1

8.1

Application Information............................................ 16

4

Revision History..................................................... 2

8.2

Typical Application ................................................. 16

5

Pin Configuration and Functions ......................... 3

9

Power Supply Recommendations ...................... 20

6

Specifications......................................................... 4

10

Layout................................................................... 20

6.1

Absolute Maximum Ratings ...................................... 4

10.1

Layout Guidelines ................................................. 20

6.2

ESD Ratings.............................................................. 4

10.2

Layout Example .................................................... 20

6.3

Recommended Operating Conditions ....................... 5

11

Device and Documentation Support ................. 21

6.4

Thermal Information .................................................. 5

11.1

Documentation Support ....................................... 21

6.5

Electrical Characteristics........................................... 5

11.2

Trademarks ........................................................... 21

6.6

Typical Characteristics .............................................. 7

11.3

Electrostatic Discharge Caution ............................ 21

7

Detailed Description ............................................ 14

11.4

Glossary ................................................................ 21

7.1

Overview ................................................................. 14

12

Mechanical, Packaging, and Orderable

7.2

Functional Block Diagram ....................................... 14

Information ........................................................... 22

4 Revision History

Changes from Revision N (December 2014) to Revision O

Page

•

Changed 30-V to 16-V ........................................................................................................................................................... 1

•

Deleted trademark symbol from VIP which is no longer trademarked .................................................................................. 1

•

Changed pin names to TI nomenclature; references to National to TI; add notes to Typical Application on first page;

fix errors in EC table reformat; replace Handling Ratings with ESD Ratings; take out Output Voltage Options and

add graphic to Mechanical section; changed LLP package name references to WSON; added overbar to

SHUTDOWN pin references; fix ulink for LP2989LV references. .......................................................................................... 1

•

Changed description of N/C pin; add description of Thermal Pad; change "Ground" to "Thermal Pad" for NGN

drawing .................................................................................................................................................................................. 3

•

Changed reference to National to TI ..................................................................................................................................... 4

•

Deleted "Operating" row from Input supply voltage; thermal values from footnote 2 ............................................................ 4

•

Changed 1.6 to 16 in ROC input supply voltage ................................................................................................................... 5

•

Added word "OFF" ................................................................................................................................................................. 6

•

Changed "high" to "low" ....................................................................................................................................................... 14

•

Changed wording of "Operation with Shutdown Control" subsection ................................................................................. 15

•

•

Changed "guaranteed" to "ensured" in "CAUTION". ............................................................................................................ 15

•

•

Changed wording of last sentence of introductory Detailed Design Procedure paragraph ................................................ 17

•

Changed words "size" and "amount" for capacitors to "value" ............................................................................................ 17

•

Changed wording of first sentence, second paragraph of Noise Bypass Capacitor subsection ......................................... 18

•

Added Documentation Support section ............................................................................................................................... 21

Changes from Revision M (February 2005) to Revision N

Page

•

Added Handling Rating table, Feature Description section, Device Functional Modes, Application and

Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation

Support section, and Mechanical, Packaging, and Orderable Information section; add updated Thermal Information

values .................................................................................................................................................................................... 1

2

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