MDS 501 K

6

Revision 071304

ICS501

Package Outline and Package Dimensions (8-pin SOIC, 150 Mil. Narrow Body)

Package dimensions are kept current with JEDEC Publication No. 95

Ordering Information

“LF” denotes Pb (lead) free package.

While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems (ICS)

assumes no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would

result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial

applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary

environmental requirements are not recommended without additional processing by ICS. ICS reserves the right to change any

circuitry or specifications without notice. ICS does not authorize or warrant any ICS product for use in life support devices or

critical medical instruments.

Part / Order Number

Marking

Shipping Packaging

Package

Temperature

ICS501M

ICS501M

Tubes

8-pin SOIC

0 to +70

° C

ICS501MT

ICS501M

Tape and Reel

8-pin SOIC

0 to +70

° C

ICS501MI

ICS501I

Tubes

8-pin SOIC

-40 to +85

° C

ICS501MIT

ICS501I

Tape and Reel

8-pin SOIC

-40 to +85

° C

ICS501MLF

501MLF

Tubes

8-pin SOIC

0 to +70

° C

ICS501MLFT

501MLF

Tape and Reel

8-pin SOIC

0 to +70

° C

ICS501-DWF

-

Die on uncut, probed wafers

0 to +70

° C

ICS501-DPK

-

Tested die in waffle pack

0 to +70

° C

INDEX

AREA

1 2

8

D

E

SEATING

PLANE

A1

A

e

- C -

B

.10 (.004)

C

C

L

H

h x 45

Millimeters

Inches

Symbol

MinMax

MinMax

A

1.35

1.75

.0532

.0688

A1

0.10

0.25

.0040

.0098

B

0.33

0.51

.013

.020

C

0.19

0.25

.0075

.0098

D

4.80

5.00

.1890

.1968

E

3.80

4.00

.1497

.1574

e

1.27 BASIC

0.050 BASIC

H

5.80

6.20

.2284

.2440

h

0.25

0.50

.010

.020

L

0.40

1.27

.016

.050

α

0

°

8

°

0

°

8

°