1 OUT

2 N/C

3 GND

IN 6

N/C 5

Bottom View

Thermal

Pad

OUT 1

N/C 2

GND 3

6 IN

5 N/C

Top View

4 EN

EN 4

Thermal

Pad

IN

A2

OUT

B2

IN

A2

OUT

B2

A1

EN

B1

GND

A1

EN

B1

GND

Top View

Bottom View

3

LP5900

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SNVS358R – JULY 2005 – REVISED JUNE 2016

Product Folder Links: LP5900

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5 Pin Configuration and Functions

YZR and YPF Packages

4-Pin DSBGA

NGF Package

6-Pin WSON with Exposed Thermal Pad

Pin Functions

PIN

TYPE

DESCRIPTION

DSBGA

WSON

NAME

A1

4

EN

I

Enable input; disables the regulator when

≤ 0.4 V. Enables the regulator when ≥

1.2 V. An internal 1-M

Ω pull-down resistor connects this input to ground.

A2

6

IN

I

Input voltage supply. Connect a 0.47-µF capacitor at this input.

B1

3

GND

—

Common ground

B2

1

OUT

O

Output voltage. A 0.47-

μF Low ESR capacitor should be connected to this pin.

Connect this output to the load circuit.

—

2

NC

—

No internal connection.

—

Thermal

Pad

Thermal Pad

—

The exposed thermal pad on the bottom of the packagemust be connected to a

copper area on the PCB under the package. TI recommends use of thermal vias

to remove heat from the package into the PCB. Connect the thermal pad to

ground potential or leave floating. Do not connect the thermal pad to any potential

other than the same ground potential seen at device pin 3. For additional

information on using TI's non-pullback WSON package, see AN-1187 Leadless

Leadframe Package (LLP) (SNOA401).