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TLE2027MFKB 数据表(PDF) 3 Page - Texas Instruments

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部件名 TLE2027MFKB
功能描述  EXCALIBUR LOW-NOISE HIGH-SPEED PRECISION OPERATIONAL AMPLIFIERS
PDF  46 Pages
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制造商  TI1 [Texas Instruments]
网页  http://www.ti.com
标志 TI1 - Texas Instruments

TLE2027MFKB 数据表(HTML) 3 Page - Texas Instruments

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TLE2027, TLE2037, TLE2027A, TLE2037A, TLE2027Y, TLE2037Y
EXCALIBUR LOW-NOISE HIGH-SPEED
PRECISION OPERATIONAL AMPLIFIERS
SLOS192C − FEBRUARY 1997 − REVISED APRIL 2010
3
TLE202xY chip information
This chip, when properly assembled, displays characteristics similar to the TLE202xC. Thermal compression
or ultrasonic bonding may be used on the doped-aluminum bonding pads. The chip may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4 × 4 MILS MINIMUM
TJmax = 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
90
73
(1)
(2)
(3)
(4)
(6)
(7)
(8)
+
−
OUT
IN +
IN −
VCC+
VCC−
OFFSET N1
OFFSET N2
(1)
(3)
(2)
(8)
(7)
(4)
(6)



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