Sensors

4

Freescale Semiconductor

MPXV5004G

PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE

Freescale Semiconductor designates the two sides of the

pressure sensor as the Pressure (P1) side and the Vacuum

(P2) side. The Pressure (P1) side is the side containing

silicone gel which isolates the die from the environment. The

Freescale Semiconductor pressure sensor is designed to

operate with positive differential pressure applied, P1 > P2.

The Pressure (P1) side may be identified by using the

table below.

INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482)

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE

MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the surface mount packages must be

the correct size to ensure proper solder connection interface

between the board and the package. With the correct

footprint, the packages will self align when subjected to a

solder reflow process. It is always recommended to design

boards with a solder mask layer to avoid bridging and

shorting between solder pads.

Figure 5. SOP Footprint (Case 482)

Part Number

Case Type

Pressure (P1) Side Identifier

MPXV5004GC6U/T1

482A

Side with Port Attached

MPXV5004G6U/T1

482

Stainless Steel Cap

MPXV5004GC7U

482C

Side with Port Attached

MPXV5004G7U

482B

Stainless Steel Cap

MPXV5004GP

1369

Side with Port Attached

MPXV5004DP

1351

Side with Port Marking

MPXV5004GVP

1368

Stainless Steel Cap

0.660

16.76

0.060 TYP 8X

1.52

0.100 TYP 8X

2.54

0.100 TYP 8X

2.54

0.300

7.62

inch

mm

SCALE 2:1