2004 July 12

27

Philips Semiconductors

Product specification

IC card interface

TDA8024

15.5

Suitability of surface mount IC packages for wave and reflow soldering methods

Notes

1. For more detailed information on the BGA packages refer to the

“(LF)BGA Application Note” (AN01026); order a copy

from your Philips Semiconductors sales office.

2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package

cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the

Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.

3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account

be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature

exceeding 217

°C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature

must be kept as low as possible.

4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder

cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,

the solder might be deposited on the heatsink surface.

5. If wave soldering is considered, then the package must be placed at a 45

° angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

6. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not

suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than

0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

8. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted

on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar

soldering process. The appropriate soldering profile can be provided on request.

9. Hot bar or manual soldering is suitable for PMFP packages.

PACKAGE(1)

SOLDERING METHOD

WAVE

REFLOW(2)

BGA, HTSSON..T(3), LBGA, LFBGA, SQFP, SSOP..T(3), TFBGA,

USON, VFBGA

not suitable

suitable

DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON,

HTQFP, HTSSOP, HVQFN, HVSON, SMS

not suitable(4)

suitable

PLCC(5), SO, SOJ

suitable

suitable

LQFP, QFP, TQFP

not recommended(5)(6)

suitable

SSOP, TSSOP, VSO, VSSOP

not recommended(7)

suitable

CWQCCN..L(8), PMFP(9), WQCCN..L(8)

not suitable

not suitable