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TDA8024T 数据表(PDF) 22 Page - NXP Semiconductors |
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TDA8024T 数据表(HTML) 22 Page - NXP Semiconductors |
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22 / 29 page ![]() 2004 July 12 22 Philips Semiconductors Product specification IC card interface TDA8024 Notes 1. All parameters remain within limits but are tested only statistically for the temperature range. When a parameter is specified as a function of VDD or VCC it means their actual value at the moment of measurement. 2. If no external bridge is used then, to avoid any disturbance, it is recommended to connect pin 18 to ground. Pin 18 is not connected in the TDA8024AT 3. To meet these specifications, pin VCC should be decoupled to CGND using two ceramic multilayer capacitors of low ESR both with values of 100 nF, or one 100 nF and one 220 nF (see Fig.13). 4. Permitted capacitor values are 100, or 100 + 100, or 220, or 220 + 100, or 330 nF. 5. Transition time and duty factor definitions are shown in Fig.12; 6. Pin CMDVCC is active LOW; pin RSTIN is active HIGH; for CLKDIV1 and CLKDIV2 functions see Table 1. 7. Pin PRES is active LOW; pin PRES is active HIGH; PRES has an integrated 1.25 µA current source to GND (PRES to VDD); the card is considered present if at least one of the inputs PRES or PRES is active. δ t 1 t 1 t 2 + --------------- = handbook, full pagewidth MDB058 10% 90% 90% 10% tr tf t1 t2 VOH VOH + VOL 2 VOL Fig.12 Definition of output and input transition times. 13 APPLICATION INFORMATION Performance can be affected by the layout of the application. For example, an additional cross-capacitance of 1 pF between card reader contacts C2 and C3 or C2 and C7 can cause contact C2 to be polluted with high frequency noise from C3 (or C7). In this case, include a 100 pF capacitor between contacts C2 and CGND. Application recommendations: • Ensure there is ample ground area around the TDA8024 and the connector; place the TDA8024 very near to the connector; decouple the VDD and VDDP lines (these lines are best positioned under the connector) • The TDA8024 and the microcontroller must use the same VDD supply. Pins CLKDIV1, CLKDIV2, RSTIN, PRES, PRES, AUX1UC, I/OUC, AUX2UC, 5V/3V, CMDVCC, and OFF are referred to VDD; if pin XTAL1 is to be driven by an external clock, also refer this pin to VDD • Track C3 should be placed as far as possible from the other tracks • The track connecting CGND to C5 should be straight (the two capacitors on C1 should be connected to this ground track) • Avoid ground loops between CGND, PGND and GND • Decouple VDDP and VDD separately; if the two supplies are the same in the application, then they should be connected in star on the main track. With all these layout precautions, noise should be kept to an acceptable level and jitter on C3 should be less than 100 ps. Reference layouts are provided in “Application note 10141”, available on request. |
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