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THERMAL INFORMATION

P

D(MAX)

+

T

J(MAX)

* T

A

R

q

JA

+ 125°C * 85°C

250

°C W

+ 160 mW

(6)

CHIP SCALE PACKAGE DIMENSIONS

TPS62300, TPS62301, TPS62302

TPS62303, TPS62305, TPS62311

TPS62313, TPS62320, TPS62321

SLVS528B – JULY 2004 – REVISED JUNE 2005

Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires

special attention to power dissipation. Many system-dependant issues such as thermal coupling, airflow, added

heat sinks, and convection surfaces, and the presence of other heat-generating components, affect the

power-dissipation limits of a given component

Three basic approaches for enhancing thermal performance are listed below:

•

Improving the power dissipation capability of the PCB design

•

Improving the thermal coupling of the component to the PCB

•

Introducing airflow in the system

125

is about 160 mW. More power can be dissipated if the maximum ambient temperature of the application is lower

or if the PowerPAD™ package (DRC) is used.

The TPS6230x, TPS6231x, and TPS6232x are also available in an 8-bump chip scale package (YZD,

NanoFree™ and YED, NanoStar™). The package dimensions are given as:

•

D = 1.970

±0.05 mm

•

E = 0.970

±0.05 mm

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