TDA3608THQ datasheet(19/22 Pages) PHILIPS

19 / 22 page

2003 Nov 28

Philips Semiconductors

Product speciﬁcation

Multiple voltage regulators with switch

TDA3608Q; TDA3608TH

During placement and before soldering, the package must

be fixed with a droplet of adhesive. The adhesive can be

applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the

adhesive is cured.

Typical dwell time of the leads in the wave ranges from

3 to 4 seconds at 250

°C or 265 °C, depending on solder

material applied, SnPb or Pb-free respectively.

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

MANUAL SOLDERING

Fix the component by first soldering two

diagonally-opposite end leads. Use a low voltage (24 V or

less) soldering iron applied to the flat part of the lead.

Contact time must be limited to 10 seconds at up to

300

°C. When using a dedicated tool, all other leads can

be soldered in one operation within 2 to 5 seconds

between 270 and 320

°C.

TDA3608THQ 数据表(PDF) 19 Page - NXP Semiconductors