TNETE2201B

1.25GIGABIT ETHERNET TRANSCEIVER

SLLS367D − JUNE 1999 − REVISED AUGUST 2007

16

POST OFFICE BOX 655303

MECHANICAL INFORMATION

The TNETE2201B incorporates the latest development in TI’s package line. The new patent-pending design,

designated the PWP, delivers thermal performance comparing to a heat-spreader design in a true low-profile

package. The PWP for the TNETE2201B is designed to maximize heat transfer away from the die through the

top of the chip. As seen in Figures 9 and 10 the bottom of the leadframe is deep downset towards the top of

the chip, providing a thermal path away from the die and board. All this has been accomplished without

exceeding the 1.15 mm height of the TQFP. This package in the 10mm

× 10mm TQFP (PJD) provides a thermal

Figure 9. Heat-Spreader Design

Figure 10. Leadframe Downset