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ISO7821 数据表(PDF) 21 Page - Texas Instruments

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部件名 ISO7821
功能描述  High-Performance, 8000 VPK Reinforced Dual Channel Digital Isolator
PDF  39 Pages
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制造商  TI1 [Texas Instruments]
网页  http://www.ti.com
标志 TI1 - Texas Instruments

ISO7821 数据表(HTML) 21 Page - Texas Instruments

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Ambient Temperature (qC)
0
50
100
150
200
0
100
200
300
400
500
600
D014
VCC1 = VCC2 = 2.75 V
VCC1 = VCC2 = 3.6 V
VCC1 = VCC2 = 5.5 V
Ambient Temperature (qC)
0
50
100
150
200
0
200
400
600
800
1000
1200
1400
1600
D015
Power
21
ISO7821, ISO7821F
www.ti.com
SLLSEM2F – NOVEMBER 2014 – REVISED MARCH 2016
Product Folder Links: ISO7821 ISO7821F
Submit Documentation Feedback
Copyright © 2014–2016, Texas Instruments Incorporated
8.3.1.2 Safety Limiting Values
Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry. A failure of
the I/O can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to overheat
the die and damage the isolation barrier potentially leading to secondary system failures.
Table 5. Safety Limiting
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
IS
Safety input, output, or supply
current for DW-16 package
and DWW-16 Packages
RθJA = 84.7°C/W, VI = 5.5 V, TJ = 150°C, TA = 25°C
268
mA
RθJA = 84.7°C/W, VI = 3.6 V, TJ = 150°C, TA = 25°C
410
RθJA = 84.7°C/W, VI = 2.75 V, TJ = 150°C, TA = 25°C
537
PS
Safety input, output, or total
power
RθJA = 84.7°C/W, TJ = 150°C, TA = 25°C
1476
mW
TS
Maximum safety temperature
150
°C
The maximum safety temperature is the maximum junction temperature specified for the device. The power
dissipation and junction-to-air thermal impedance of the device installed in the application hardware
determines the junction temperature. The assumed junction-to-air thermal resistance in the Thermal
Information is that of a device installed on a High-K test board for Leaded Surface Mount Packages. The
power is the recommended maximum input voltage times the current. The junction temperature is then the
ambient temperature plus the power times the junction-to-air thermal resistance.
Figure 13. Thermal Derating Curve for Safety Limiting
Current per VDE
Figure 14. Thermal Derating Curve for Safety Limiting
Power per VDE



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