TPS3779, TPS3780

SBVS250 – APRIL 2015

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7 Specifications

7.1 Absolute Maximum Ratings

over operating junction temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VDD

–0.3

7

V

OUT1, OUT2 (TPS3779 only)

–0.3

VDD + 0.3

V

Voltage

OUT1, OUT2 (TPS3780 only)

–0.3

7

V

SENSE1, SENSE2

–0.3

7

V

Current

OUT1, OUT2

±20

mA

–40

125

°C

Temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic

V

discharge

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating junction temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Power-supply voltage

1.5

6.5

V

Sense voltage

SENSE1, SENSE2

0

6.5

V

Output voltage (TPS3779 only)

OUT1, OUT2

0

VDD + 0.3

V

Output voltage (TPS3780 only)

OUT1, OUT2

0

6.5

V

Pullup resistor (TPS3780 only)

1.5

10,000

k

Ω

Current

OUT1, OUT2

–5

5

mA

Input capacitor

0.1

µF

Junction temperature

–40

25

125

°C

7.4 Thermal Information

TPS3779, TPS3780

DRY (USON)

DBV (SOT23-6)

UNIT

6 PINS

6 PINS

Junction-to-ambient thermal resistance

306.7

193.9

Junction-to-case (top) thermal resistance

174.1

134.5

Junction-to-board thermal resistance

173.4

39.0

°C/W

Junction-to-top characterization parameter

30.9

30.4

Junction-to-board characterization parameter

171.6

38.5

Junction-to-case (bottom) thermal resistance

65.2

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, .

4

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