Pin Descriptions

Pin No.

(SOIC)

Name Description

2, 6,

10, 14

R

IN+

Non-inverting receiver input pin

1, 7, 9,

15

R

IN−

Inverting receiver input pin

3, 5,

11, 13

R

OUT

Receiver output pin

4

EN

Active high enable pin, OR-ed with

EN*

12

EN*

Active low enable pin, OR-ed with EN

16

V

CC

8

GND Ground pin

Ordering Information

Operating

Package Type/

Order Number

Temperature

Number

−40˚C to +85˚C

SOP/M16A

DS90C032TM

−55˚C to +125˚C

LCC/E20A

DS90C032E-QML

DS90C032E-QML (NSID)

5962-95834

(SMD)

Note 1: “Absolute Maximum Ratings” are those values beyond which the

safety of the device cannot be guaranteed. They are not meant to imply that

the devices should be operated at these limits. The table of “Electrical

Characteristics” specifies conditions of device operation.

Note 2: Current into device pins is defined as positive. Current out of device

pins is defined as negative. All voltages are referenced to ground unless

otherwise specified.

Note 4: Generator waveform for all tests unless otherwise specified:f=1

or EN*.

Note 5: Channel-to-Channel Skew is defined as the difference between the

propagation delay of one channel and that of the others on the same chip with

an event on the inputs.

Note 6: Chip to Chip Skew is defined as the difference between the mini-

mum and maximum specified differential propagation delays.

Note 7: ESD Rating:

HBM (1.5 k

Ω, 100 pF) ≥ 3,500V

EIAJ (0

Ω, 200 pF) ≥ 250V

minus sign indicates direction only. Only one output should be shorted at a

time, do not exceed maximum junction temperature specification.

Note 10: For DS90C032E propagation delay measurements are from 0V on

Typical Performance Characteristics

Output High Voltage vs

Power Supply Voltage

Output High Voltage vs

Ambient Temperature

01194508

01194509

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