7-10

Model 165

PACKAGING

Package Size

A wide variety of custom packaging from 0.25" to 3.0" on a side

Package types

Metal (seam weld), metal (solder seal), ceramic (seam weld),ceramic

(solder seal), ceramic (epoxy seal) and polymer encapsulated (PEP)

Package configurations

SIP, DIP, Plug-in (platform or sidewall),Planar (flatpack) and LCC

Thick Film Resistors

Absolute Accuracy

to 0.5%

Temperature Coefficient of Resistance

±50ppm/°C to ±200ppm/°C

Temperature Coefficient of Resistance Tracking

±10ppm/°C

Thin Film Resistors

Absolute Accuracy

to 0.1%

Temperature Coefficient of Resistance

±5ppm/°C to ±50ppm/°C

Temperature Coefficient of Resistance Tracking

±2ppm/°C

Operating Temperature Range

-55°C to +125°C

Functional Trimming

Circuit accuracies can be tightened on

certain parameters by performing active

functional trimming on resistor elements

MECHANICAL

Substrate

Alumina (beryllia also available)

Interconnect Layers

1 to 6

Interconnect Material

Gold or palladium silver

Die Attach

Epoxy (solder, eutectic also available)

Package Construction

Metal with glass insulated feedthroughs and cofired ceramic

COMPONENT TECHNOLOGIES

Semiconductor Components

All transistors & diodes in die form

Integrated Circuits

IC or ASIC in die form

Capacitors

Ceramic chip, tantalum chip and bondable MOS capacitors

Other Components

Wide range of components including inductors, transformers, crystals, etc

ELECTRICAL