ZXTR2012FF datasheet(2/7 Pages) DIODES

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ZXTR2012FF

Document number: DS38199 Rev. 2 - 2

2 of 7

www.diodes.com

April 2016

ZXTR2012FF

Absolute Maximum Ratings (Voltage relative to GND, @TA = +25°C, unless otherwise specified.)

Characteristic

Symbol

Value

Unit

Input Supply Voltage

VIN

-0.3 to 100

Continuous Input & Output Current

IIN, IOUT

550

Peak Pulsed Input & Output Current

IIM, IOM

Maximum Voltage Applied to VOUT

VOUT(MAX)

Maximum Current at VIN = 48V (@TA = +25°C, unless otherwise specified.)

Characteristic

Symbol

Value

Unit

Continuous Output Current

(Note 7)

IOUT

Pulsed Output Current

(Note 8)

IOM

880

(Note 9)

180

Thermal Characteristics

Characteristic

Symbol

Value

Unit

Power Dissipation

(Note 5)

1.3

(Note 6)

Thermal Resistance, Junction to Ambient

(Note 5)

RθJA

°C/W



(Note 6)

126

Thermal Resistance, Junction to Lead

(Note 10)

RθJL

Thermal Resistance, Junction to Case

(Note 10)

RθJC

Maximum Operating Junction and Storage Temperature Range

TJ , TSTG

-65 to +150

C

ESD Ratings (Note 11)

Characteristics

Symbols

Value

Unit

JEDEC Class

Electrostatic Discharge

– Human Body Model

ESD HBM

4,000

Electrostatic Discharge

– Machine Model

ESD MM

400

Notes:

5. For a device mounted with the exposed VIN pad on 25mm x 25mm 1oz copper that is on a single-sided 1.6mm FR-4 PCB; device is measured under still

air conditions whilst operating in steady-state.

6. Same as note 5, except mounted on 15mm x 15mm 1oz copper.

7. Same as note 5, whilst operating at VIN = 48V. Refer to Safe Operating Area for other Input Voltages.

8. Same as note 5, except measured with a single pulse width = 100µs and VIN = 48V.

9. Same as note 5, except measured with a single pulse width = 10ms and VIN = 48V.

10.

RθJL = Thermal resistance from junction to solder-point (on the exposed VIN pad).

RθJC = Thermal resistance from junction to the top of case.

11. Refer to JEDEC specification JESD22-A114 and JESD22-A115

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