Pad Assignment

* The IC substrate should be connected to VDD in the PCB layout artwork.

Pad Coordinates

Unit: mil

Pad No.

X

Y

Pad No.

X

Y

Pad No.

X

Y

1

-55.73

37.50

18

-16.79

-54.72

35

55.46

35.51

2

-55.73

30.58

19

3.90

-54.72

36

55.46

42.86

3

-55.73

23.66

20

12.43

-54.72

37

55.46

50.20

4

-55.73

16.77

21

18.40

-54.72

38

37.60

55.02

5

-55.73

9.85

22

31.48

-54.72

39

30.26

55.02

6

-55.73

2.85

23

45.02

-54.72

40

22.91

55.02

7

-55.73

-4.07

24

55.50

-54.72

41

15.57

55.02

8

-55.73

-11.00

25

55.46

-37.96

42

8.22

55.02

9

-55.73

-17.96

26

55.46

-30.58

43

0.88

55.02

10

-55.73

-24.84

27

55.46

-23.24

44

-6.46

55.02

11

-55.73

-31.73

28

55.46

-15.89

45

-13.81

55.02

12

-55.73

-38.65

29

55.46

-8.55

46

-21.15

55.02

13

-55.73

-47.03

30

55.46

-1.21

47

-28.50

55.02

14

-52.02

-54.72

31

55.46

6.14

48

-35.84

55.02

15

-41.35

-54.72

32

55.46

13.48

49

-43.18

55.02

16

-32.86

-54.72

33

55.46

20.83

50

-50.53

55.02

17

-25.97

-54.72

34

55.46

28.17

HT1611C

Rev. 1.10

2

August 17, 2001

1

26

2

27

3

28

4

29

5

30

6

31

7

32

8

33

9

34

10

35

11

36

12

37

13

38

14

39

15

40

16

41

17

42

18

43

19

44

20

45

21

46

22

47

23

48

24

49

25

50

(0,0)

SEG2

SEG14

SEG13

SEG12

SEG11

SEG10

SEG9

SEG8

SEG7

SEG6

SEG5

SEG4

SEG3

HK

INT

12/24

SEG28

SEG29

SEG30

COM2

S2

X2

X1

TIMER

T2

T1