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LM4899 数据表(PDF) 13 Page - National Semiconductor (TI) |
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LM4899 数据表(HTML) 13 Page - National Semiconductor (TI) |
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13 / 16 page ![]() Application Information (Continued) However, a direct consequence of the increased power de- livered to the load by a bridge amplifier is an increase in internal power dissipation versus a single-ended amplifier operating at the same conditions. P DMAX = 4*(VDD) 2 /(2 π2R L) Bridge Mode (2) Since the LM4899 has bridged outputs, the maximum inter- nal power dissipation is 4 times that of a single-ended am- plifier. Even with this substantial increase in power dissipa- tion, the LM4899 does not require additional heatsinking under most operating conditions and output loading. From Equation 3, assuming a 5V power supply and an 8 Ω load, the maximum power dissipation point is 625mW. The maxi- mum power dissipation point obtained from Equation 3 must not be greater than the power dissipation results from Equa- tion 4: P DMAX =(TJMAX -TA)/ θ JA (3) The LM4899’s θ JA in an MUA10A package is 190˚C/W. Depending on the ambient temperature, T A, of the system surroundings, Equation 4 can be used to find the maximum internal power dissipation supported by the IC packaging. If the result of Equation 3 is greater than that of Equation 4, then either the supply voltage must be decreased, the load impedance increased, the ambient temperature reduced, or the θ JA reduced with heatsinking. In many cases, larger traces near the output, V DD, and GND pins can be used to lower the θ JA. The larger areas of copper provide a form of heatsinking allowing higher power dissipation. For the typical application of a 5V power supply, with an 8 Ω load, the maximum ambient temperature possible without violating the maximum junction temperature is approximately 30˚C pro- vided that device operation is around the maximum power dissipation point. Recall that internal power dissipation is a function of output power. If typical operation is not around the maximum power dissipation point, the LM4899 can operate at higher ambient temperatures. Refer to the Typical Per- formance Characteristics curves for power dissipation in- formation. POWER SUPPLY BYPASSING As with any power amplifier, proper supply bypassing is critical for low noise performance and high power supply rejection ratio (PSRR). The capacitor location on both the bypass and power supply pins should be as close to the device as possible. A larger half-supply bypass capacitor improves PSRR because it increases half-supply stability. Typical applications employ a 5V regulator with 10µF and 0.1µF bypass capacitors that increase supply stability. This, however, does not eliminate the need for bypassing the supply nodes of the LM4899. Although the LM4899 will operate without the bypass capacitor C B, although the PSRR may decrease. A 1µF capacitor is recommended for C B. This value maximizes PSRR performance. Lesser values may be used, but PSRR decreases at frequencies below 1kHz. The issue of C B selection is thus dependant upon desired PSRR and click and pop performance. SHUTDOWN FUNCTION In order to reduce power consumption while not in use, the LM4899 contains shutdown circuitry that is used to turn off the amplifier’s bias circuitry. In addition, the LM4899 con- tains a Shutdown Mode pin, allowing the designer to desig- nate whether the part will be driven into shutdown with a high level logic signal or a low level logic signal. This allows the designer maximum flexibility in device use, as the Shutdown Mode pin may simply be tied permanently to either V DD or GND to set the LM4899 as either a "shutdown-high" device or a "shutdown-low" device, respectively. The device may then be placed into shutdown mode by toggling the Shut- down Select pin to the same state as the Shutdown Mode pin. For simplicity’s sake, this is called "shutdown same", as the LM4899 enters shutdown mode whenever the two pins are in the same logic state. The trigger point for either shutdown high or shutdown low is shown as a typical value in the Supply Current vs Shutdown Voltage graphs in the Typical Performance Characteristics section. It is best to switch between ground and supply for maximum perfor- mance. While the device may be disabled with shutdown voltages in between ground and supply, the idle current may be greater than the typical value of 0.1µA. In either case, the shutdown pin should be tied to a definite voltage to avoid unwanted state changes. In many applications, a microcontroller or microprocessor output is used to control the shutdown circuitry, which pro- vides a quick, smooth transition to shutdown. Another solu- tion is to use a single-throw switch in conjunction with an external pull-up resistor (or pull-down, depending on shut- down high or low application). This scheme guarantees that the shutdown pin will not float, thus preventing unwanted state changes. www.national.com 13 |
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