MIL-STD-883C

For complete Military Specifications, refer to the appro-

priate SMD or MDS.

Storage Temperature Range (T

−65˚C to +175˚C

Lead Temperature (Soldering, 60 sec.)

300˚C

Maximum Package Power Dissipation (Note 9) at 25˚C

Ceramic LCC (E)

2000 mW

Ceramic DIP (J)

1800 mW

Ceramic Flatpak (W)

1000 mW

Supply Voltage

7.0V

Enable Input Voltage

5.5V

Recommended Operating

Conditions

Min

Typ

Max

Units

Supply Voltage (V

DS96F172M/DS96F174M

4.50

5.0

5.50

V

Common Mode

−7.0

+12.0

V

Output Voltage (V

Output Current HIGH (I

−60

mA

Output Current LOW (I

mA

Operating Temperature (T

DS96F172M/DS96F174M

−55

+125

package 7.1 mW/˚C

Over recommended supply voltage and operating temperature range unless otherwise specified

Symbol

Parameter

Conditions

Min

Max

Units

V

IH

Input Voltage HIGH

2.0

V

V

IL

Input Voltage LOW

T

0.8

V

T

0.7

V

IC

Input Clamp Voltage

I

−1.5

V

|V

Differential Output Voltage

I

6.0

V

|V

Differential Output Voltage

R

T

1.2

Figure 1

T

1.5

V

R

2.0

∆|V

Change in Magnitude of Differential

R

V

Output Voltage (Note 5)

V

−55˚C

V

V

OC

Common Mode Output Voltage

(Note 6)

R

3.0

V

∆|V

Change in Magnitude of Common

R

V

Mode Output Voltage (Note 5)

I

O

Output Current with Power Off

V

µA

I

OZ

High Impedance State Output Current

V

µA

I

IH

Input Current HIGH

V

20

µA

I

IL

Input Current LOW

V

−50

µA

I

OS

Short Circuit Output Current

V

−250

(Note 7)

V

−150

mA

V

150

V

250

I

CC

Supply Current (All Drivers)

No Load

Outputs Enabled

50

mA

I

CCX

Outputs Disabled

30

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