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MPC8247CVRM 数据表(PDF) 14 Page - Motorola, Inc |
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MPC8247CVRM 数据表(HTML) 14 Page - Motorola, Inc |
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14 / 56 page ![]() 14 MPC8272 PowerQUICC II™ Family Hardware Specifications MOTOROLA PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE Power Dissipation Power Dissipation 5 Power Dissipation Table 7 provides preliminary, estimated power dissipation for various configurations. Note that suitable thermal management is required to ensure the junction temperature does not exceed the maximum specified value. Also note that the I/O power should be included when determining whether to use a heat sink. For a complete list of possible clock configurations, refer to Section 7, “Clock Configuration Modes.” 6 AC Electrical Characteristics The following sections include illustrations and tables of clock diagrams, signals, and CPM outputs and inputs for 66.67-/83.33-/100-MHz MPC8272 devices. Note that AC timings are based on a 50-pf load. Typical output buffer impedances are shown in Table 8. 6.1 CPM AC Characteristics Table 9 lists CPM output characteristics. Table 7. Estimated Power Dissipation for Various Configurations 1 1 Test temperature = 105˚ C) Bus (MHz) CPM Multiplication Factor CPM (MHz) CPU Multiplication Factor CPU (MHz) PINT(W) 2, 3 2 P INT = IDD x VDD Watts 3 Values do not include I/O. Add the following estimates for active I/O based on the following bus speeds: 66.7 MHz = 0.35 W (nominal), 0.4 W (maximum) 83.3 MHz = 0.4 W (nominal), 0.5 W (maximum) 100 MHz = 0.5 W (nominal), 0.6 W (maximum) Vddl 1.5 Volts Nominal Maximum 66.67 3 200 4 266 0.75 0.8 100 2 200 3 300 0.85 0.9 100 2 200 4 400 1 1.05 Table 8. Output Buffer Impedances 1 1 These are typical values at 65˚ C. Impedance may vary by ±25% with process and temperature. Output Buffers Typical Impedance ( Ω) 60x bus 45 Memory controller 45 Parallel I/O 45 PCI 25 Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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