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SN74LVC1G10DBVR 数据表(PDF) 1 Page - Texas Instruments

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部件名 SN74LVC1G10DBVR
功能描述  SINGLE 3 INPUT POSITIVE NAND GATE
PDF  11 Pages
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制造商  TI [Texas Instruments]
网页  http://www.ti.com
标志 TI - Texas Instruments

SN74LVC1G10DBVR 数据表(HTML) 1 Page - Texas Instruments

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SN74LVC1G10
SINGLE 3INPUT POSITIVENAND GATE
SCES486B − SEPTEMBER 2003 − REVISED FEBRUARY 2004
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
D Available in the Texas Instruments
NanoStar
 and NanoFree Packages
D Supports 5-V VCC Operation
D Inputs Accept Voltages to 5.5 V
D Max tpd of 3.8 ns at 3.3 V
D Low Power Consumption, 10-µA Max ICC
D ±24-mA Output Drive at 3.3 V
D Ioff Supports Partial-Power-Down Mode
Operation
D Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
D ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
description/ordering information
The SN74LVC1G10 performs the Boolean function Y = A
• B • C or Y = A + B + C in positive logic.
NanoStar
 and NanoFree package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
TA
PACKAGE†
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING‡
NanoStar
 − WCSP (DSBGA)
0.23-mm Large Bump − YEP
Tape and reel
SN74LVC1G10YEPR
_ _ _C2_
−40
°C to 85°C
NanoFree
 − WCSP (DSBGA)
0.23-mm Large Bump − YZP (Pb-free)
Tape and reel
SN74LVC1G10YZPR
_ _ _C2_
SOT (SOT-23) − DBV
Tape and reel
SN74LVC1G10DBVR
C10_
SOT (SC-70) − DCK
Tape and reel
SN74LVC1G10DCKR
C2_
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
‡ DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition
(1 = SnPb,
= Pb-free).
Copyright
 2004, Texas Instruments Incorporated
NanoStar and NanoFree are trademarks of Texas Instruments.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
DBV OR DCK PACKAGE
(TOP VIEW)
1
2
3
6
5
4
A
GND
B
C
VCC
Y
3
2
1
4
5
6
B
GND
A
Y
VCC
C
YEP OR YZP PACKAGE
(BOTTOM VIEW)
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.


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