www.ti.com

A

Y

2

4

A

Y

1

3

SN74LVC1G07

SINGLE BUFFER/DRIVER

WITH OPEN-DRAIN OUTPUT

SCES296T – FEBRUARY 2000 – REVISED OCTOBER 2005

ORDERING INFORMATION

ORDERABLE

TOP-SIDE

PART NUMBER

NanoStar™ – WCSP (DSBGA)

SN74LVC1G07YEAR

0.17-mm Small Bump – YEA

NanoFree™ – WCSP (DSBGA)

SN74LVC1G07YZAR

0.17-mm Small Bump – YZA (Pb-free)

Reel of 3000

_ _ _CV_

NanoStar™ – WCSP (DSBGA)

SN74LVC1G07YEPR

0.23-mm Large Bump – YEP

NanoFree™ – WCSP (DSBGA)

SN74LVC1G07YZPR

0.23-mm Large Bump – YZP (Pb-free)

–40°C to 85°C

NanoFree™ – WCSP (DSBGA)

_ _ _ _

Reel of 3000

SN74LVC1G07YZVR

0.23-mm Large Bump – YZV (Pb-free)

CV

Reel of 3000

SN74LVC1G07DBVR

SOT (SOT-23) – DBV

C07_

Reel of 250

SN74LVC1G07DBVT

Reel of 3000

SN74LVC1G07DCKR

SOT (SC-70) – DCK

CV_

Reel of 250

SN74LVC1G07DCKT

SOT (SOT-553) – DRL

Reel of 4000

SN74LVC1G07DRLR

CV_

(1)

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

(2)

DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site.

YEA/YEP, YZA/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one

following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,

• = Pb-free).

YZV: The actual top-side marking is on two lines. Line 1 has four characters to denote year, month, day, and assembly/test site. Line 2

has two characters which show the family and function code. Pin 1 identifier indicates solder-bump composition (1 = SnPb,

• = Pb-free).

FUNCTION TABLE

INPUT

OUTPUT

A

Y

H

H

L

L

LOGIC DIAGRAM (POSITIVE LOGIC)

(DBV, DCK, DRL, YEA, YEP, YZA, and YZP Package)

LOGIC DIAGRAM (POSITIVE LOGIC)

(YZV Package)

2