SN74LVC2G17DBVR datasheet(1/13 Pages) TI

部件名	SN74LVC2G17DBVR

功能描述	DUAL SCHMITT TRIGGER BUFFER

PDF	13 Pages

Scroll/Zoom	100%

制造商	TI [Texas Instruments]

网页	http://www.ti.com

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1 / 13 page

SN74LVC2G17

DUAL SCHMITT TRIGGER BUFFER

SCES381E − JANUARY 2002 − REVISED SEPTEMBER 2003

1

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

D Available in the Texas Instruments

NanoStar

 and NanoFree Packages

D Supports 5-V VCC Operation

D Inputs Accept Voltages to 5.5 V

D Max tpd of 5.4 ns at 3.3 V

D Low Power Consumption, 10-µA Max ICC

D ±24-mA Output Drive at 3.3 V

D Typical VOLP (Output Ground Bounce)

<0.8 V at VCC = 3.3 V, TA = 25°C

D Typical VOHV (Output VOH Undershoot)

>2 V at VCC = 3.3 V, TA = 25°C

D Ioff Supports Partial-Power-Down Mode

Operation

D Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

D ESD Protection Exceeds JESD 22

− 2000-V Human-Body Model (A114-A)

− 1000-V Charged-Device Model (C101)

description/ordering information

This dual Schmitt-trigger buffer is designed for 1.65-V to 5.5-V VCC operation.

The SN74LVC2G17 contains two buffers and performs the Boolean function Y = A. The device functions as two

independent buffers, but because of Schmitt action, it may have different input threshold levels for positive-going

(VT+) and negative-going (VT−) signals.

ORDERING INFORMATION

TA

PACKAGE†

ORDERABLE

PART NUMBER

TOP-SIDE

MARKING‡

NanoStar

 − WCSP (DSBGA)

0.17-mm Small Bump − YEA

SN74LVC2G17YEAR

NanoFree

 − WCSP (DSBGA)

0.17-mm Small Bump − YZA (Pb-free)

Reel of 3000

SN74LVC2G17YZAR

_ _ _C7_

−40 C to 85 C

NanoStar

 − WCSP (DSBGA)

0.23-mm Large Bump − YEP

Reel of 3000

SN74LVC2G17YEPR

_ _ _C7_

−40

°C to 85°C

NanoFree

 − WCSP (DSBGA)

0.23-mm Large Bump − YZP (Pb-free)

SN74LVC2G17YZPR

SOT (SOT-23) − DBV

Reel of 3000

SN74LVC2G17DBVR

C17_

SOT (SOT-23) − DBV

Reel of 250

SN74LVC2G17DBVT

C17_

SOT (SC-70) − DCK

Reel of 3000

SN74LVC2G17DCKR

C7_

SOT (SC-70) − DCK

Reel of 250

SN74LVC2G17DCKT

C7_

† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

‡ DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.

YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,

and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition

(1 = SnPb,

• = Pb-free).

Copyright

 2003, Texas Instruments Incorporated

DBV OR DCK PACKAGE

(TOP VIEW)

1

2

3

6

5

4

1A

GND

2A

1Y

VCC

2Y

3

2

1

4

5

6

2A

GND

1A

2Y

VCC

1Y

YEA, YEP, YZA, OR YZP PACKAGE

(BOTTOM VIEW)

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

NanoStar and NanoFree are trademarks of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.

类似零件编号 - SN74LVC2G17DBVR

制造商	部件名	数据表	功能描述
Texas Instruments	SN74LVC2G17DBVR	599Kb / 15P	DUAL SCHMITT-TRIGGER BUFFER
	SN74LVC2G17DBVR	600Kb / 15P	DUAL SCHMITT-TRIGGER BUFFER
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Guangdong Youtai Semico...	SN74LVC2G17DBVR	1Mb / 9P	SN74LVC2G17
Texas Instruments	SN74LVC2G17DBVR	1Mb / 34P	SN74LVC2G17 Dual Schmitt-Trigger Buffer REVISED JANUARY 2015

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类似说明 - SN74LVC2G17DBVR

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