TPA751

700-mW MONO LOW-VOLTAGE AUDIO POWER AMPLIFIER

WITH DIFFERENTIAL INPUTS

SLOS336C – DECEMBER 2000 – REVISED OCTOBER 2002

2

POST OFFICE BOX 655303

AVAILABLE OPTIONS

PACKAGED DEVICES

MicroStar-Junior (BGA)‡

(GQS)

SMALL OUTLINE†

(D)

MSOP‡

(DGN)

Device

TPA751GQS

TPA751D

TPA751DGN

Package symbolization

TPA751

TPA751

ATC

† In the SOIC package, the maximum RMS output power is thermally limited to 350 mW; 700 mW peaks can be driven, as long

as the RMS value is less than 350 mW.

‡ The D, DGN, and GQS packages are available taped and reeled. To order a taped and reeled part, add the suffix R to the

part number (e.g., TPA751DR).

Terminal Functions

TERMINAL

NAME

NO.

I/O

DESCRIPTION

NAME

GQS

D, DGN

I/O

DESCRIPTION

BYPASS

E3

2

I

BYPASS is the tap to the voltage divider for internal mid-supply bias. This terminal should be

connected to a 0.1-

µF to 2.2-µF capacitor when used as an audio amplifier.

GND

§

7

GND is the ground connection.

IN –

E5

4

I

IN – is the inverting input. IN – is typically used as the audio input terminal.

IN+

E4

3

I

IN + is the noninverting input. IN + is typically tied to the BYPASS terminal for SE input.

SHUTDOWN

E2

1

I

SHUTDOWN places the entire device in shutdown mode when held low (IDD = 1.5 nA).

VDD

A4

6

VDD is the supply voltage terminal.

VO+

A5

5

O

VO+ is the positive BTL output.

VO–

A2

8

O

VO– is the negative BTL output.

§ A1, A3, A5, B1–B5, C1–C5, D1–D5 are electrical and thermal connections to the ground plane.

6 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Continuous total power dissipation

Internally limited (see Dissipation Rating Table)

. . . . . . . . . . . . . . . . . . . . .

– 40

°C to 85°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

– 40

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

–65

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds

260

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

¶ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

DISSIPATION RATING TABLE

PACKAGE

TA = 25°C

DERATING FACTOR

TA = 70°C

TA = 85°C

GQS||

1.66 W||

13.3 mW/

°C

1.06 W

866 mW

D

725 mW

5.8 mW/

°C

464 mW

377 mW

DGN

2.14 W#

17.1 mW/

°C

1.37 W

1.11 W

# See the Texas Instruments document, PowerPAD Thermally Enhanced Package Application Report

(SLMA002), for more information on the PowerPAD package. The thermal data was measured on a PCB

layout based on the information in the section entitled Texas Instruments Recommended Board for PowerPAD

on page 33 of that document.

|| See the Texas Instruments document, MicroStar Junior

 Made Easy Application Brief (SSYA009A) for board

layout information on the MicroStar Junior package.