NCP382

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3

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

From IN to OUT1, From IN to OUT2 Supply Voltage (Note 1)

−7.0 to +7.0

V

IN, OUT1,OUT2, EN1, EN2, FLAG1, FLAG2 (Note 1)

−0.3 to +7.0

V

FLAG1, FLAG2 sink current

1.0

mA

ESD Withstand Voltage (IEC 61000−4−2) (output only, when

bypassed with 1.0

mF capacitor minimum)

ESD IEC

15 Air, 8 contact

kV

Human Body Model (HBM) ESD Rating are (Note 2)

ESD HBM

2000

V

Machine Model (MM) ESD Rating are (Note 2)

ESD MM

200

V

Latch−up protection (Note 3)

− Pins IN, OUT1, OUT2, FLAG1, FLAG2

− EN1, EN2

LU

100

mA

Maximum Junction Temperature (Note 4)

−40 to + TSD

°C

Storage Temperature Range

−40 to + 150

°C

Moisture Sensitivity (Note 5)

MSL

Level 1

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

1. According to JEDEC standard JESD22−A108.

2. This device series contains ESD protection and passes the following tests:

Human Body Model (HBM) +/−2.0 kV per JEDEC standard: JESD22−A114 for all pins.

Machine Model (MM) +/−200 V per JEDEC standard: JESD22−A115 for all pins.

3. Latch up Current Maximum Rating:

$100 mA per JEDEC standard: JESD78 class II.

4. A thermal shutdown protection avoids irreversible damage on the device due to power dissipation.

5. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020.

OPERATING CONDITIONS

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Operational Power Supply

2.5

5.5

V

Enable Voltage

0

5.5

Ambient Temperature Range

−40

25

+85

°C

FLAG sink current

1

mA

Decoupling input capacitor

1

mF

Decoupling output capacitor

USB port per Hub

120

mF

Thermal Resistance Junction−to−Air

DFN−8 package (Notes 6 and 7)

140

°C/W

SOIC−8 package (Notes 6 and 7)

210

°C/W

Junction Temperature Range

−40

25

+125

°C

Recommended Maximum DC

current

DFN−8 package

2

A

SOIC−8 package

1.5

A

Power Dissipation Rating (Note 8)

DFN−8 package

850

mW

SOIC−8 package

570

mW

DFN−8 package

428

mW

SOIC−8 package

285

mW

6. A thermal shutdown protection avoids irreversible damage on the device due to power dissipation.

final PCB layout.

P

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