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BAT20JFILM 数据表(PDF) 3 Page - STMicroelectronics |
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BAT20JFILM 数据表(HTML) 3 Page - STMicroelectronics |
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3 / 5 page ![]() BAT20J 3/5 I(A) P 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0 25 50 75 100 125 150 T (°C) amb T δ=tp/T tp Printed circuit board FR4 S =2.25mm CU 2 Fig. 1: Peak forward current versus ambient temperature ( δ = 0.11). 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0 25 50 75 100 125 150 I(A) F(AV) T δ=tp/T tp T (°C) amb Printed circuit board FR4 S =2.25mm CU 2 Fig. 2: Average forward current versus ambient temperature ( δ = 0.5). 1.E-03 1.E-02 1.E-01 1.E+00 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Z/R th(j-a) th(j-a) t(s) p Single pulse S =2.25mm CU 2 Fig. 3: Relative variation of thermal impedance junction to ambient versus pulse duration . 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 1.E+04 0 25 50 75 100 125 150 I(T Rj Rj ) / =25°C I(T ) T (°C) j V =5V R Fig. 5: Relative variation of reverse leakage currrent versus junction temperature (typical values). 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 1.E+04 0 2 4 6 8 10 12141618 202224 I (µA) R V (V) R T =25°C j T =85°C j T =150°C j Fig. 4: Reverse leakage currrent versus reverse voltage applied (typical values). 1 10 100 1 10 100 C(pF) V (V) R F=1MHz V =30mV T =25°C OSC RMS j Fig. 6: Junction capacitance versus reverse voltage applied (typical values). |
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