TPS730

SBVS054J – NOVEMBER 2004 – REVISED APRIL 2015

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Table of Contents

8.1

Application Information............................................ 11

1

Features .................................................................. 1

8.2

Typical Application .................................................. 13

2

Applications ........................................................... 1

8.3

Do's and Don'ts ....................................................... 14

3

Description ............................................................. 1

9

Power Supply Recommendations ...................... 15

4

Revision History..................................................... 2

10

Layout................................................................... 15

5

Pin Configuration and Functions ......................... 3

10.1

Layout Guidelines ................................................. 15

6

Specifications......................................................... 4

10.2

Layout Example .................................................... 15

6.1

Absolute Maximum Ratings ...................................... 4

10.3

Thermal Considerations ........................................ 16

6.2

ESD Ratings ............................................................ 4

10.4

Power Dissipation ................................................. 16

6.3

Recommended Operating Conditions ....................... 4

11

Device and Documentation Support ................. 18

6.4

Thermal Information .................................................. 4

11.1

Device Support...................................................... 18

6.5

Electrical Characteristics .......................................... 5

11.2

Documentation Support ........................................ 18

6.6

Typical Characteristics .............................................. 6

11.3

Trademarks ........................................................... 18

7

Detailed Description .............................................. 9

11.4

Electrostatic Discharge Caution ............................ 18

7.1

Overview ................................................................... 9

11.5

Glossary ................................................................ 18

7.2

Functional Block Diagrams ....................................... 9

12

Mechanical, Packaging, and Orderable

7.3

Feature Description................................................. 10

Information ........................................................... 18

7.4

Device Functional Modes........................................ 10

12.1

TPS730YZQ Nanostar™ Wafer Chip Scale

8

Application and Implementation ........................ 11

Information ............................................................... 19

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision I (February, 2011) to Revision J

Page

•

Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation

section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and

Mechanical, Packaging, and Orderable Information section ................................................................................................. 1

•

Changed fourth bullet of Features list to low noise ............................................................................................................... 1

•

Changed front-page figure ..................................................................................................................................................... 1

•

Added Pin Configuration and Functions section .................................................................................................................... 3

•

Changed "free-air temperature" to "junction temperature" in Absolute Maximum Ratings condition statement ................... 4

•

Deleted Dissipation Ratings table; added Thermal Information table ................................................................................... 4

•

Added condition statement to Typical Characteristics ........................................................................................................... 6

•

Moved Ordering Information to Device Nomenclature section ............................................................................................ 18

Changes from Revision H (October, 2007) to Revision I

Page

•

Corrected units in y-axis of Figure 5....................................................................................................................................... 6

2

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