CL2 datasheet(3/15 Pages) MICROCHIP

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 2015 Microchip Technology Inc.

DS20005448A-page 3

CL2

1.0

ELECTRICAL CHARACTERISTICS

ABSOLUTE MAXIMUM RATINGS†

Operating voltage, VA-B........................................................................................................................................... 100V

Operating junction temperature, Tj........................................................................................................... -40 to +125 °C

Storage Temperature, Ts .......................................................................................................................... -55 to +150 °C

Note 1: Mounted on FR4 board, 25mm x 25mm x 1.57 mm

† Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is

a stress rating only and functional operation of the device at those or any other conditions above those indicated in the

operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods

may affect device reliability.

DC AND AC CHARACTERISTICS

Electrical Specifications: Unless otherwise specified, for all specifications TA = +25°C

Parameter

Symbol

Min

Typ

Max

Units Conditions

Operating voltage

VA-B

5.0

---

Current regulation

IA-B

18.0

VA-B= 5.0V - 90V

IA-B temperature coefficient

∆IA-B/∆T

0.01

%/°C VA-B= 45V, Tj= -40°C to +100°C

Operating junction temperature

-40

125

°C

---

Dynamic resistance

RA-B

-300

kΩ

---

TEMPERATURE SPECIFICATIONS

Parameter

Symbol

Min

Typ

Max

Units Conditions

Temperature Ranges

Operating Junction Temperature

-40

–

125

°C

Storage Temperature

-55

–

150

°C

Package Thermal Resistances

Thermal Resistance, TO-92

θja

–

132

–

°C/W

Thermal Resistance, TO-252

θja

–81

–

°C/W Note 1

Thermal Resistance, TO-243AA

θja

–

133

–

°C/W Note 1

TABLE 1-1:

THERMAL CHARACTERISTICS

Package

Power Dissipation

@TA = 2.5°C (W)

Conditions

TO-92

0.6

TO-252

2.0

Note 1

TO-243AA

1.3

Note 1

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