MPX2010 MPXV2010G SERIES

6

Motorola Sensor Device Data

SMALL OUTLINE PACKAGE DIMENSIONS—CONTINUED

CASE 1351–01

ISSUE O

D

E

e/2

N

e

A

M

0.004 (0.1)

B

C

A

E1

A

B

C

0.004 (0.1)

A

0.006 (0.15)

B

C

2 PLACES 4 TIPS

DETAIL G

SEATING

PLANE

8X

P

1

4

8

5

NOTES:

1. CONTROLLING DIMENSION: INCH.

2. INTERPRET DIMENSIONS AND TOLERANCES PER

ASME Y14.5M-1994.

3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD

FLASH OR PROTRUSIONS. MOLD FLASH OR

PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152)

PER SIDE.

4. DIMENSION "b" DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR PROTRUSION

SHALL BE 0.008 (0.203) MAXIMUM.

DIM

A

MIN

MAX

MIN

MAX

MILLIMETERS

0.370

0.390

9.39

9.91

INCHES

A1

0.002

0.010

0.05

0.25

b

0.038

0.042

0.96

1.07

D

0.465

0.485

11.81

12.32

E

0.680

0.700

17.27

17.78

E1

0.465

0.485

11.81

12.32

e

M

0.270

0.290

6.86

7.37

N

0.160

0.180

4.06

4.57

P

0.009

0.011

0.23

0.28

T

0.110

0.130

2.79

3.30

0.100 BSC

2.54 BSC

F

0.240

0.260

6.10

6.60

K

0.115

0.135

2.92

3.43

L

0.040

0.060

1.02

1.52

F

K

M

T

∅

GAGE

DETAIL G

L

A1

θ

.014 (0.35)

PLANE

0

7

0

7

°°

°°

θ

STYLE 1:

PIN 1. GND

2. +Vout

3. Vs

4. -Vout

5. N/C

6. N/C

7. N/C

8. N/C

STYLE 2:

PIN 1. N/C

2. Vs

3. GND

4. Vout

5. N/C

6. N/C

7. N/C

8. N/C

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com