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XP-G2 数据表(PDF) 1 Page - Cree, Inc

部件名 XP-G2
功能描述  Cree XLamp XP-G2 LEDs
PDF  30 Pages
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制造商  CREE [Cree, Inc]
网页  http://www.cree.com/
标志 CREE - Cree, Inc

XP-G2 数据表(HTML) 1 Page - Cree, Inc

  XP-G2 Datasheet HTML 1Page - Cree, Inc XP-G2 Datasheet HTML 2Page - Cree, Inc XP-G2 Datasheet HTML 3Page - Cree, Inc XP-G2 Datasheet HTML 4Page - Cree, Inc XP-G2 Datasheet HTML 5Page - Cree, Inc XP-G2 Datasheet HTML 6Page - Cree, Inc XP-G2 Datasheet HTML 7Page - Cree, Inc XP-G2 Datasheet HTML 8Page - Cree, Inc XP-G2 Datasheet HTML 9Page - Cree, Inc Next Button
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Product family data sheet
Copyright © 2012-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are
registered trademarks and the Cree logo is a trademark of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
Cree® XLamp® XP-G2 LEDs
ProDuCt DEsCriPtion
The XLamp® XP-G2 LeD builds on the
unprecedented performance of the
original XP-G by increasing lumen output
up to 20% while providing a single die LeD
point source for precise optical control.
The XP-G2 LeD shares the same footprint
as the original XP-G, providing a seamless
upgrade path and shortening the design
cycle.
XLamp XP-G2 LeDs are the ideal choice
for lighting applications where high
light output and maximum efficacy are
required, such as LeD light bulbs, outdoor
lighting, portable lighting, indoor lighting
and solar-powered lighting.
FEAturEs
• Available in white, outdoor white and
80-, 85- and 90-CRI white
• ANSI-compatible chromaticity bins
• Binned at 85 °C
• Maximum drive current: 1500 mA
• Low thermal resistance: 4 °C/W
• Wide viewing angle: 115°
• Unlimited floor life at
≤ 30 ºC/85% RH
• Reflow solderable - JEDEC J-STD-020C
• electrically neutral thermal path
• RoHS and REACh compliant
• UL® recognized component (E349212)
tAbLE oF ContEnts
Characteristics ............................................2
Flux Characteristics ....................................3
Relative Spectral Power Distribution ...... 10
Relative Flux vs. Junction Temperature.. 10
electrical Characteristics......................... 11
Relative Flux vs. Current .......................... 11
Relative Chromaticity vs Current and
Temperature ............................................. 12
Typical Spatial Distribution...................... 13
Thermal Design........................................ 13
Performance Groups – Luminous Flux... 14
Performance Groups – Chromaticity...... 15
Cree’s Standard Chromaticity Regions
Plotted on the 1931 CIE Curve ................ 18
Cree’s Standard Cool White Kits Plotted
on ANSI Standard Chromaticity
Regions..................................................... 20
Cree’s Standard Warm and Neutral
White Kits Plotted on ANSI Standard
Chromaticity Regions .............................. 21
Cree’s Standard Chromaticity Kits .......... 23
Bin and Order Code Formats................... 24
Reflow Soldering Characteristics............ 25
Notes ........................................................ 26
Mechanical Dimensions .......................... 28
Tape and Reel........................................... 29
Packaging................................................. 30


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