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XP-G3 数据表(PDF) 14 Page - Cree, Inc |
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XP-G3 数据表(HTML) 14 Page - Cree, Inc |
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14 / 33 page ![]() Copyright © 2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, XLamp® and EasyWhite® are registered trademarks and SC5 Technology and the Cree logo are trademarks of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 14 XLamp® Xp-G3 LED tyPiCAL sPAtiAL Distribution thErMAL DEsiGn The maximum forward current is determined by the thermal resistance between the LED junction and ambient. It is crucial for the end product to be designed in a manner that minimizes the thermal resistance from the solder point to ambient in order to optimize lamp life and optical characteristics. Typical Spatial Radiation Pattern 0% 20% 40% 60% 80% 100% -90 -70 -50 -30 -10 10 30 50 70 90 Angle (º) Thermal Design 0 250 500 750 1000 1250 1500 1750 2000 2250 0 20 40 60 80 100 120 140 160 Ambient Temperature (ºC) Rj-a = 10°C/W Rj-a = 15°C/W Rj-a = 20°C/W Rj-a = 25°C/W |
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