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XP-L 数据表(PDF) 16 Page - Cree, Inc |
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XP-L 数据表(HTML) 16 Page - Cree, Inc |
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16 / 35 page ![]() Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo and SC5 Technology™ are trademarks of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 16 XLamp® Xp-L LED tyPICAL sPAtIAL DIstrIbutIon tHErMAL DEsIgn The maximum forward current is determined by the thermal resistance between the LeD junction and ambient. It is crucial for the end product to be designed in a manner that minimizes the thermal resistance from the solder point to ambient in order to optimize lamp life and optical characteristics. Typical Spatial Radiation Pattern 0 20 40 60 80 100 -90 -70 -50 -30 -10 10 30 50 70 90 Angle (º) XP-L High Density XP-L High Intensity Thermal Design Cool White 0 500 1000 1500 2000 2500 3000 3500 0 20 40 60 80 100 120 140 160 Ambient Temperature (ºC) Rj-a = 4°C/W Rj-a = 7°C/W Rj-a = 10°C/W Rj-a = 15°C/W |
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