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XP-L2 数据表(PDF) 1 Page - Cree, Inc

部件名 XP-L2
功能描述  Cree XLamp XP-L2 LEDs
PDF  24 Pages
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制造商  CREE [Cree, Inc]
网页  http://www.cree.com/
标志 CREE - Cree, Inc

XP-L2 数据表(HTML) 1 Page - Cree, Inc

  XP-L2 Datasheet HTML 1Page - Cree, Inc XP-L2 Datasheet HTML 2Page - Cree, Inc XP-L2 Datasheet HTML 3Page - Cree, Inc XP-L2 Datasheet HTML 4Page - Cree, Inc XP-L2 Datasheet HTML 5Page - Cree, Inc XP-L2 Datasheet HTML 6Page - Cree, Inc XP-L2 Datasheet HTML 7Page - Cree, Inc XP-L2 Datasheet HTML 8Page - Cree, Inc XP-L2 Datasheet HTML 9Page - Cree, Inc Next Button
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Product family data sheet
Copyright © 2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, XLamp® and EasyWhite®
are registered trademarks and SC5 Technology™ and the Cree logo are trademarks of Cree, Inc. UL® and the UR logo are registered trademarks of UL
LLC.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
Cree® XLamp® XP-L2 LEDs
ProDuCt DEsCriPtion
The XLamp® XP-L2 LeD is Cree’s
highest
performing
high-density
discrete LeD. Leveraging key elements
of Cree’s SC5 Technology™ Platform,
the high-power XP-L2 LeD improves the
lumen density, voltage characteristics
and reliability of the XP-L LeD in the
same 3.45  mm  x  3.45  mm package.
This best-in-class performance enables
lighting
manufacturers
to
deliver
differentiated solutions at lower system
costs for applications such as roadway,
outdoor area, spot and high-bay lighting.
FEAturEs
• Available in white, 70-CRI white, 80-CRI
white and 90-CRI white
• ANSI-compatible chromaticity bins
• Binned at 85 °C
• Maximum drive current: 3000 mA
• Low thermal resistance: 2.2 °C/W
• Wide viewing angle: 125°
• Unlimited floor life at
≤ 30 ºC/85% RH
• Reflow solderable - JEDEC J-STD-020C
• electrically neutral thermal path
• UL® recognized component (e349212)
tAbLE oF ContEnts
Characteristics ............................................2
Flux Characteristics - EasyWhite® Order
Codes and Bins ...........................................3
Flux Characteristics - ANSI Order Codes
and Bins.......................................................6
Relative Spectral Power Distribution ...... 10
Relative Flux vs. Junction Temperature.. 10
electrical Characteristics......................... 11
Relative Flux vs. Current .......................... 11
Relative Chromaticity vs. Current............ 12
Relative Chromaticity vs. Temperature... 12
Typical Spatial Distribution...................... 13
Thermal Design........................................ 13
Performance Groups - Luminous Flux.... 14
Performance Groups - Chromaticity....... 15
Cree’s EasyWhite® Kits Plotted on ANSI
Standard Chromaticity Regions .............. 16
Cree’s ANSI Kits Plotted on ANSI
Standard Chromaticity Regions .............. 17
Cree’s Standard Chromaticity Kits .......... 19
Bin and Order Code Formats................... 19
Reflow Soldering Characteristics............ 20
Notes ........................................................ 21
Mechanical Dimensions .......................... 22
Tape and Reel........................................... 23
Packaging................................................. 24


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